PROFORMA 300iSA
PROFORMA 300iSA Semi-Automated Semiconductor Wafer Metrology & Inspection
Industry-leading capacitance measurement built for semiconducting and semi-insulating wafers. Deliver full surface scanning for thickness, bow, warp, and global flatness with intuitive semi-automated operation and exclusive MTII Push-Pull technology.
1000 µm Thickness Range
±0.25 µm Thickness Accuracy
Full 3D Wafer Imaging
Non-Contact Capacitance
ASTM & SEMI Compliant
150, 200 & 300 mm Wafers
COMPREHENSIVE. PRECISE. SEMI-AUTOMATED.
3D Semiconductor Wafer Profiling and Inspection
The Proforma 300iSA is an advanced benchtop metrology platform engineered for full surface scanning of semiconducting and semi-insulating materials in QA/QC and laboratory environments. Combining MTII’s exclusive Push-Pull capacitance technology, user-defined scan patterns, and comprehensive 3D imaging, the 300iSA delivers faster inspection execution, improved operator efficiency, and highly accurate wafer verification with full ASTM and SEMI compliance traceability.
Engineered for Today’s High-Precision Semiconductor Quality Control
ACCELERATE INSPECTION
IMPROVE ACCURACY
COMPREHENSIVE PROFILING
SEAMLESS DATA REPORTING
The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.
Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.
- Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm
- Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
- Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
- Flat/Notch: All SEMI Standard Flat(s) or Notch
- Conductivity: P or N Type
- Exclusive MTI capacitance sensors for outstanding accuracy and repeatability
- Full 1000 µm thickness measurement range without re-calibration
- Measures Thickness, TTV, Bow, Warp and site and Global Flatness
- Windows® user interface
- ASTM Standard measurements
- SEMI S2-0200 health and safety compliant design
- SEMI S8-0999 ergonomic compliant design
- Measures all materials including Si, GaAs, Ge, InP, SiC ***
*** provided bulk resistivity is less than 20K Ohm/cm
| Specification | Range | Accuracy | |
|---|---|---|---|
| Thickness | ASTM F533 | +/- 500 µm | +/- 0.25 µm |
| TTV | ASTM F657 | +/- 500 µm | +/- 0.25 µm |
| Bow | ASTM F534 | +/- 250 µm | +/- 2.0 µm |
| Warp | ASTM F1390 | +/- 250 µm | +/- 2.0 µm |
| Sori | ASTM F1451 | +/- 250 µm | +/- 2.0 µm |
| Flatness (Site) | ASTM F1530 | 8 mm * | +/- 0.15 µm |
| Flatness (Global) | ASTM F1530 | 8 mm * | +/- 0.15 µm |
| Industry | Measurement Type | Applications |
|---|---|---|
| Semiconductor | Surface | Wafer QA/QC after slicing and polishing |
Operating the Proforma 300iSA Semi-automated Metrology System
Creating a Recipe File for the Proforma 300iSA
Creating a Recipe File for the Proforma 300iSA
Metrology Product Family Video
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