Proforma 300i

Non-Contact Semiconductor Wafer Metrology

Capacitance-based differential measurement built for semiconducting and semi-insulating wafers. Deliver precise thickness and bow assessment, exceptional accuracy across all materials, and seamless integration using proprietary MTI Push/Pull technology.

Vitrek V10X Series Hipot Tester
PRECISE. NON-CONTACT. COST-EFFECTIVE.

Manual Semiconductor Metrology System

The Proforma 300i wafer thickness gauge is a capacitance-based, differential measurement system that performs completely non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI’s proprietary Push/Pull technology, the Proforma 300i does not require wafers to have a consistent electrical ground, resulting in exceptional accuracy and dependability across a diverse range of materials. Designed as a highly capable, cost-effective alternative to fully automated inspection systems, it streamlines quality control and ensures your wafers meet strict surface specifications.

  • Provides highly accurate, non-contact measurement of thickness, bow, warp, and TTV.
  • Measures all wafer materials including Silicon, Gallium-Arsenide (GaAs), Indium-Phosphide, sapphire, and tape.
  • Proprietary Capacitance Circuitry delivers an exceptional ±0.25 µm accuracy and up to 1700 µm range.
  • Accommodates a flexible 76 mm to 300 mm diameter wafer range.
  • Includes built-in wafer stops for exact centering and optional wafer measurement rings.
  • Equipped with a front USB port to enable easy storage of measurements and data directly to flash drives.
  • Features an Ethernet interface and includes full Windows-compatible remote control operating software.
  • A cost-effective manual alternative to fully automated wafer measurement and inspection systems.

Engineered for Today’s Semiconductor Quality Control Environments

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Proforma 300i wafer thickness gauge, including for semiconductor wafers
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