Proforma 300i wafer thickness gauge, including for semiconductor wafers

Cost-effective alternative to full-automated wafer measurement and inspection systems

Product can provide measurement of thickness and bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape.

The Proforma 300i wafer thickness gauge is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.

*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance.