Non-Destructive Testing (NDT) for Steel Manufacturing
Non-Destructive Testing (NDT) for Steel Manufacturing Customer Case The customer is a custom-built contractor of Non-Destructive Test (NDT) instruments for steel manufacturing. NDT uses ultrasonic pulses to scan through thick sheets of metals for possible causes of early wear, such as cracks or impurities. The stimulus is a stream of ultrasonic pulses. The response is their reflection from various depths. The center frequencies used by this customer are in the range of 250 KHz to 2.25 MHz and pulses are about 10 microseconds. The pulse repeat frequency (PRF) is less than 1 KHz. The thickness of steel sheets is [...]
Sheet Metal Monitoring
Sheet Metal Monitoring Automotive Sheet Metal Monitoring Thickness Description Introduction: When sheet metal is formed in a continuous process it needs monitoring during the actual feed prior to machining or forming to prevent defects and scrap.  One way to accomplish this is to use a laser sensor to measure the thickness. Problem: A major electrical equipment manufacturer needed a way to monitor the incoming material just prior to shearing and forming. The device needed to be robust, non-contact, reliable, accurate, and fast. The client would be using their data acquisition [...]
Galvannealing Phosphor Thermometry
Galvannealing Phosphor Thermometry Customer Case During the process of galvanizing, steel is dipped in a bath of liquid tin to increase its resistance to oxidation and moisture. After galvanizing, a precise heat treatment allows control of the mechanical properties of the final galvanized steel. This heat treatment is known as galvannealing. During galvannealing, precise temperature control is necessary to promote the desired grain growth in the steel's tin-rich coating. Galvanneal thermometry is difficult. The rolling of the hot steel makes contact thermocouples and optical pyrometry impractical. A customer's galvanneal furnace is equipped for phosphor thermometry. This novel technique uses [...]
Wire Bonding
Wire Bonding Semiconductor Wire Bonding Level Description Introduction What is Wire Bonding? Wire bonding is a critical semiconductor manufacturing process that creates electrical connections between integrated circuits (ICs) and their packaging substrates. This wire bonding technique uses ultra-thin bond wires, typically made of gold or aluminum, to establish reliable electrical pathways in microelectronics applications. Understanding Wire Bond Fundamentals A typical wire bond consists of bonded wire connecting a die pad to a substrate pad on a PC board. The bond wire diameter varies between 18 and 50 microns, with 25 microns [...]
GaAs Substrate Thickness Measurement
Semiconductor Gaas Substrate Thickness Measurement Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction:  Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI's Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor's measuring field. Fortunately, MTI has a solution to this problem. Solution:  It’s possible to measure the thickness and TTV of high resistivity semiconducting wafers (like GaAs) using non-contact [...]
Pulsed Electric Field Food Processing
Pulsed Electric Field Food Processing Customer Case Pulsed Electric Field Food Processing is a continuous food processing system in which beverages (with a known conductivity) are pumped through a chamber containing an electrode. Pulses of high voltage electricity are passed across the electrode, thus through the liquid as well. It is a pasteurization technique being studied at Ohio State University. The need is to be able to monitor, display, and record to hard drive storage, voltage and current waveforms. They need to be able to draw information about the pulse duration, peak voltage, etc. from the recorded waveforms. Waveforms [...]
Photolithography Using Capacitance Sensors
Photolithography Using Capacitance Sensors Semiconductor Photolithography Using Capacitance Sensors Positioning Description When it comes to photolithography, how accurate are our sensors? Accurate enough to measure this: ​   Photo by D. Carr and H. Craighead, Cornell The world's smallest guitar is 10 micrometers long -- about the size of a single cell -- with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]
Phase Conjugate Sonar
Phase Conjugate Sonar Customer Case Dissipationless physical systems, such as simple planetary motion or a swinging pendulum, exhibit time-reversal invariance. This means that if time were reversed the way a film projector can be, then the resulting motion would be allowed by the equations governing the system. It follows that if all velocities in a dissipationless system are suddenly reversed, the system will follow a time-reversed trajectory. Dissipationless or adiabatic wave propagation is time-reversal invariant. Phase Conjugate Optics involves the deliberate reversal of complex light paths. A customer is doing Phase Conjugate Sonar using sound instead of light. The [...]
Adding a Digital Panel Meter to MTI Analog Output Products
Adding a Digital Panel Meter to MTI Analog Output Products Consumer Electronics Electronics Parts Profiling Thickness Description Some MTI Products with Analog outputs, Accumeasure 9000 and Microtrak 3 laser How To Use Digital Displays with Analog Outputs MTI Microtrak 3 Lasers and some of our Accumeasure amplifiers such as the Accumeasure 9000 only have analog outputs. If you wish to add a digital display, then the Lascar Panel pilot © makes a nice cost effective (~ $110) addition - Fig 1. These Digital panel meters have both 1 [...]
GaGe Whitepaper: Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications GalleryGaGe Whitepaper: Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications
Industry-Aerospace, Industry-Consumer Products, Industry-Electronics, Industry-Government/Military, Whitepapers-GaGe, z1, ZOK
GaGe Whitepaper: Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications
Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications By Gerald Allgaier, GaGe ( a Vitrek Brand) Introduction Orange Labs, the research & development division of the French telecommunications multi-national, Orange, presented a paper[1] at the 13th European Conference on Antennas and Propagation (EUCAP 2019) held in Krakow, Poland. Introduced in the paper, was an innovative wideband radio channel sounder that conducts reliable, easy-to-use measurements in demanding 5G applications, such as outdoor drive tests. This article describes the GaGe EON Express 3 GS/s 12-bit PCIe Gen3 Digitizer that Orange Labs [...]