This is the second of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Most semiconductor wafers are made of silicon, the second most common element in the Earth’s [...]
Capacitance Probe Detects Water Contamination in Oiling Systems Industrial, Research & Development Capacitance Probe Detection of Water Contamination Metrology, Tolerances Description [Application Note 12218]  The adverse effects of water in oil are well known. Negative consequences include higher viscosity reduced load carrying ability hydrolysis (the [...]
Digital Capacitance Sensor Provides Closed-Loop Piezo Positioning Control Consumer Electronics, Industrial Closed-Loop Piezo Positioning Control Positioning, Robot Guide Description [Application Note 40418] 21st century electronic manufacturing requires fast, precise positioning of miniature components. For many assembly lines, process control has moved from mm to micron, [...]
Signal Generator Calibrates Strain Gauge Electronics Industrial, Automotive, Transportation, Research & Development, Civil Engineering Calibration of Strain Gauge Electronics Amplitude; Bending, Tensile & Compression Description [Application Note 31218] The strain gauge has been in use many years and is the fundamental sensing element for many [...]
Signal Generator Simulates Eddy Current Probe Industrial, Power Generation, Automotive, Power Generation, R& D, Solar Simulation of Eddy Current Probe Gap, Amplitude, Displacement, Positioning, Thickness Description [Application Note 31218] Non-contact eddy current probes can be used to measure the position, or position change, of conductive [...]
Capacitance Sensors Facilitate 3D IC Construction Semiconductor, Research & Development 3D IC Construction Distance, Positioning, Displacement Description [Application Note 70518] To boost device performance, today's semiconductor and microelectronics manufacturers are building three-dimensional integrated circuits featuring vertically-stacked silicon wafers and dies. The rationale is simple. Exploiting [...]
Adding a Digital Panel Meter to MTI Analog Output Products Consumer Electronics Electronics Parts Profiling Thickness Description Some MTI Products with Analog outputs, Accumeasure 9000 and Microtrak 3 laser  How To Use Digital Displays with Analog Outputs MTI Microtrak 3 Lasers and some [...]
Thickness Gauge Measurement With Conductive Wafers and Thin Films Consumer Electronics Electronics Parts Profiling Thickness Description Using MTI's capacitive thickness gauge Proforma 300i with conductive wafers and thin films G = (a+b+t1+t2 ) Where G is the fixed gap between two probes When making [...]
Measuring Piezoelectric Properties with Fiber Optics Research & Development Piezoceramic, 1-3 Pzt / Polymer Composite And Pvdf Film Amplitude Description MTI-2000 Fotonic Sensor Introduction Researchers from the University of Arizona used the MTI-2000 Fotonic Sensor to measure the indirect piezoelectric properties (d33) and [...]
Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI's Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. [...]
