Wafer Measurement – Ungrounded
Wafer Measurement - Ungrounded Semiconductor Wafer Measurement - Ungrounded Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
High-Speed Signal Recording Systems
High-Speed Signal Recording Systems PC Instrumentation Systems for High-Speed Data Acquisition GaGe has a long history of providing high-speed, real-time signal acquisition, processing, and recording systems on PC-based platforms. This expertise saves customers time and eliminates uncertainties and risks with self-integrated systems. The advantage of the open PC-based system platform is that it allows the capability to mix and match a variety of instruments tailored for a specific application requirement with very high-speed data transfer rates via the PCIe interface for real-time signal-based solutions. Unlike traditional boxed-based test equipment, whose functionality is set [...]
Wafer Thickness, Bow, Warp And TTV
Semiconductor Wafer Thickness, Bow, Warp And Ttv Surface Description Thickness Measurement ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness encountered during a scan pattern or series of point measurements. TTV is expressed in microns or mils (thousandths of an inch). Figure above shows a wafer placed between two non-contact measurement probes. By monitoring changes between the upper probe face [...]
About Vitrek
About Vitrek About Vitrek Since 1990, Vitrek has provided innovative global solutions for High Voltage Test and Measurement. Our advanced automated Electrical Safety Compliance Testers verify insulation integrity and ground bonding on a single device or a complex system. Our multi-point HV scanners automatically route voltages up to 15KV to hundreds of test points. Vitrek supplies Precision High Voltage Measurement Standards to national laboratories and calibration labs around the world and our Graphical Power Analyzers set the standard for world class performance at a very economical price. In addition to manufacturing superior quality test and [...]
Tape Cartridge Movement
Tape Cartridge Movement Semiconductor Tape Cartridge Movement Positioning Description Researchers are presently working on drives with track widths in the 5 to 1 micron region. For these small widths, tape wander, properly called Lateral Tape Movement (LTM), must be less than 1 micron. This is because the track following head always lags the moving target and produces a position error signal. If the position error signal gets to be larger than about 1/10 the track width, the track cannot be read. However, it follows that the smaller the LTM, the [...]
Older PBS Support Policy
Valued PBS customers and partners: MTI Instruments prides itself on providing consistent, quality experiences for our customers. We recognize the importance of having products you can rely on to perform required functions consistently and accurately. As with any aging system, components become obsolete, parts become subject to wear and tear, software becomes vulnerable to cybersecurity risks, and older operating systems are incompatible with current operating environments. To that end, starting on August 1st, 2021, we will no longer be able to offer calibration and repair services on PBS-4100 and PBS-4100R built on/before 2012. If you have one of these [...]
Wafer QA/QC After Slicing And Polishing
Wafer QA/QC After Slicing And Polishing Semiconductor Wafer Qa/Qc After Slicing And Polishing Surface Description Introduction:When wafers are sliced up with wire saws, they are measured to make sure they are within the specified thickness, with minimal bow, warp, and TTV. After initial measurement, they are sorted and sent for polishing. Since polishing removes material and smoothes out the rough surfaces they need to be measured again to ensure they meet thickness guidelines and quality standards. Solution:MTI Instruments manufactures multiple systems to perform thickness measurements. From semi automated Proforma 300SA to manual [...]
Mobile Devices
Consumer Electronics Mobile Devices Dimensions Description
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