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MTI Customer Satisfaction Survey

MTI Instruments' team of experts looks forward to supporting your next application.  Feel free to use this form to provide feedback on MTI Instruments' products. If you need immediate assistance please feel free to contact us via phone at (815) 838-0005. MTI Instruments, Inc. 900 N. State Street Lockport, IL 60441 USA | Map It Toll-Free: +1-800-342-2203 Tel: +1-518-218-2550 Fax: +1-518-218-2506

By |May 24th, 2023|Comments Off on MTI Customer Satisfaction Survey

MTI-Customer Satisfaction Survey: Product

Please complete the survey below to provide feedback information on MTI Instruments Products. MTI Instruments by Vitrek 900 N. State Street Lockport, IL 60441 Phone: (800) 342-2203 Outside North America: (518) 218-2550 Fax: (518) 218-2506 sales@mtiinstruments.com

By |May 24th, 2023|Comments Off on MTI-Customer Satisfaction Survey: Product

Thermal Expansion On Automobile Engine

Thermal Expansion On Automobile Engine Automotive Thermal Expansion On Automobile Engine Dimensions Description For years the sole purpose of the oil pan was to act as a reservoir for the engine lubricant. Some modern engines now utilize the pan as a structural component. It is machined from a rigid steel or aluminum casting and designed to support the lower portion of the crankshaft bearings and rear main seal. This development has introduced a potential problem area that must be analyzed. As engines go through heating and cooling cycles it is [...]

Sheet Metal Monitoring

Sheet Metal Monitoring Automotive Sheet Metal Monitoring Thickness Description Introduction: When sheet metal is formed in a continuous process it needs monitoring during the actual feed prior to machining or forming to prevent defects and scrap.  One way to accomplish this is to use a laser sensor to measure the thickness. Problem: A major electrical equipment manufacturer needed a way to monitor the incoming material just prior to shearing and forming. The device needed to be robust, non-contact, reliable, accurate, and fast. The client would be using their data acquisition [...]

Wire Bonding

Wire Bonding Semiconductor Wire Bonding Level Description Introduction What is Wire Bonding? Wire bonding is a critical semiconductor manufacturing process that creates electrical connections between integrated circuits (ICs) and their packaging substrates. This wire bonding technique uses ultra-thin bond wires, typically made of gold or aluminum, to establish reliable electrical pathways in microelectronics applications. Understanding Wire Bond Fundamentals A typical wire bond consists of bonded wire connecting a die pad to a substrate pad on a PC board. The bond wire diameter varies between 18 and 50 microns, with 25 microns [...]

GaAs Substrate Thickness Measurement

Semiconductor Gaas Substrate Thickness Measurement Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction:  Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI's Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor's measuring field. Fortunately, MTI has a solution to this problem. Solution:  It’s possible to measure the thickness and TTV of high resistivity semiconducting wafers (like GaAs) using non-contact [...]

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