Avionics Bus Monitoring
Avionics Bus Monitoring Customer Case The requirement is to monitor anomalies on an avionics bus that controls systems aboard spacecrafts. The customer will know typical rise times, and therefore, will look for anomalous high-voltage pulses that may occur due to sunspots or cosmic rays. An A/D card with at least 12-bits of vertical resolution is required to capture anomalous glitches for characterization. The required sampling speed is 50 KHz, on two simultaneous channels that monitor two bus lines. The input signal bandwidth is typically 4 KHz. The customer would like to write his own data acquisition application programs in [...]
Wafer Thickness, Bow, Warp And TTV
Semiconductor Wafer Thickness, Bow, Warp And Ttv Surface Description Thickness Measurement ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness encountered during a scan pattern or series of point measurements. TTV is expressed in microns or mils (thousandths of an inch). Figure above shows a wafer placed between two non-contact measurement probes. By monitoring changes between the upper probe face [...]
Tape Cartridge Movement
Tape Cartridge Movement Semiconductor Tape Cartridge Movement Positioning Description Researchers are presently working on drives with track widths in the 5 to 1 micron region. For these small widths, tape wander, properly called Lateral Tape Movement (LTM), must be less than 1 micron. This is because the track following head always lags the moving target and produces a position error signal. If the position error signal gets to be larger than about 1/10 the track width, the track cannot be read. However, it follows that the smaller the LTM, the smaller [...]
Wafer QA/QC After Slicing And Polishing
Wafer QA/QC After Slicing And Polishing Semiconductor Wafer Qa/Qc After Slicing And Polishing Surface Description Introduction:When wafers are sliced up with wire saws, they are measured to make sure they are within the specified thickness, with minimal bow, warp, and TTV. After initial measurement, they are sorted and sent for polishing. Since polishing removes material and smoothes out the rough surfaces they need to be measured again to ensure they meet thickness guidelines and quality standards. Solution:MTI Instruments manufactures multiple systems to perform thickness measurements. From semi automated Proforma 300SA to manual [...]
Radar Altimeter
Radar Altimeter Customer Case In this RADAR application the customer has pulses coming in at 1660 Hz. For every pulse they need to capture 500 samples which, at that rate, will amount to 1.7 Megs of data every second. The experiment will be running for at least a few minutes. They would then like to log all the captured data to the PC host memory. The final requirement is for the system to be on the PCI bus. By having the system on the PCI bus, the customer can stream the data directly to the PC's memory, which is [...]
Mobile Devices
Consumer Electronics Mobile Devices Dimensions Description
Ultra High-Speed Radar
Ultra High-Speed Radar Customer Case This application requires the acquisition of very fast analog signals at relatively slow sample rates for a long period of time. In other words, the input bandwidth requirement is very high (1 GHz), but the sampling rate needs to be no more than 5 or 6 MSPS. The most important requirement is that the acquisition must go on, without any breaks, for many hours. The customer does not need very high dynamic range. In fact, a 4-bit A/D converter will be sufficient. The customer has already identified a 4-bit A/D chip from TRW which [...]
Height Gap Of Inkjet Printers
Height Gap Of Inkjet Printers Consumer Electronics Height Gap Of Inkjet Printers Positioning Description Introduction:  Inkjet printers require a certain distance between the inkjet print head and the paper. If the distance is set incorrectly, the printed images get blurry. Current state of the art printers have the print head nozzles built right into the bottom of the ink reservoir (B) as shown below. When the ink cartridge is installed in the printer, the inkjet nozzles (made out of silicon) essentially become a grounded target through the connections shown at [...]
Electronics Parts Profiling
Electronics Parts Profiling Consumer Electronics Electronics Parts Profiling Thickness Description MTI's 2D laser sensors can be used to scan 3D profiles of items such as printed circuit boards to verify all the parts are installed, making sure parts don’t exceed certain heights or that the part is present. You can even plot or examine the image intensity profile of the 2D sensor which yields a monochromatic image of the target and this can be used with OCR software or barcode software to recognize product codes, check if labels are present or [...]
Radar Rackmount System for Large Record Lengths
Radar Rackmount System for Large Record Lengths Customer Case The customer needs to acquire data from his radar system at a sampling rate of 1.5 MSPS for two channels (I & Q). At the moment, this data must be acquired for at least 10 seconds, but the record length may increase by almost 100 times in the future. This equipment needs to be installed in a rackmounted environment, so the host computer must have rackmount capability. An integrated monitor is also important as it eliminates the need to purchase a rack-mounted monitor. Keyboard and mouse must also be rackmountable. [...]