Plasma Coating of Airplane Parts
Plasma Coating of Airplane Parts Customer Case The customer produces plasma coating for airplane parts. They need to count the number of plasma particles on these parts so that they can adjust the plasma torch to be less or more powerful in order to obtain the required thickness of plasma coating. Using a particle detector, they are able to measure temperature, speed and quantity of particles. These parameters are used as feedback to control the plasma coating process. GaGe Case Solution The customer requires a scope card that has both high-resolution and a fast sampling rate. At the time [...]
Tire Tread Inspection With 1D Laser Sensor
Tire Tread Inspection With 1D Laser Sensor Automotive Tire Tread Inspection With 1D Laser Sensor Depth Description Tire manufacturers wants to satisfy their customers, and protect themselves from liabilities, manufacturers are moving to 100% tire inspection for defects and abnormalities. Defects not only cause potential safety issues but they can also introduce unwanted vibration into the vehicle suspension system. Belts can be overlapped, or not cover the complete tire surface, causing weak or bubbled areas and imbalances. The tread depth can be too shallow, leading to decreased service life. An [...]
Gas Turbine Monitoring
Gas Turbine Monitoring Customer Case A customer who designs and develops turbo-machinery uses automated data-acquisition and reduction routines. The complete system can sequentially scan up to 144 pressures, 40 electrical signals, and 50 temperatures. It can also acquire and analyze dynamic pressure/vibration signals as well as the scanned steady-state data. They do precise pneumatic traversing for high-performance radial-flow stages. Using a computer-controlled data-acquisition system, the detailed internal pressures and temperatures can be acquired and processed. Laboratory data files are generated, which can be directly used to process the impeller-cover static pressure data. The data can also be automatically processed [...]
Thermal Expansion On Automobile Engine
Thermal Expansion On Automobile Engine Automotive Thermal Expansion On Automobile Engine Dimensions Description For years the sole purpose of the oil pan was to act as a reservoir for the engine lubricant. Some modern engines now utilize the pan as a structural component. It is machined from a rigid steel or aluminum casting and designed to support the lower portion of the crankshaft bearings and rear main seal. This development has introduced a potential problem area that must be analyzed. As engines go through heating and cooling cycles it is [...]
Robotic Weld Inspection
Automotive Robotic Weld Inspection Presence/Absence Description
Avionics Bus Monitoring
Avionics Bus Monitoring Customer Case The requirement is to monitor anomalies on an avionics bus that controls systems aboard spacecrafts. The customer will know typical rise times, and therefore, will look for anomalous high-voltage pulses that may occur due to sunspots or cosmic rays. An A/D card with at least 12-bits of vertical resolution is required to capture anomalous glitches for characterization. The required sampling speed is 50 KHz, on two simultaneous channels that monitor two bus lines. The input signal bandwidth is typically 4 KHz. The customer would like to write his own data acquisition application programs in [...]
Sheet Metal Monitoring
Sheet Metal Monitoring Automotive Sheet Metal Monitoring Thickness Description Introduction: When sheet metal is formed in a continuous process it needs monitoring during the actual feed prior to machining or forming to prevent defects and scrap.  One way to accomplish this is to use a laser sensor to measure the thickness. Problem: A major electrical equipment manufacturer needed a way to monitor the incoming material just prior to shearing and forming. The device needed to be robust, non-contact, reliable, accurate, and fast. The client would be using their data acquisition [...]
Wire Bonding
Wire Bonding Semiconductor Wire Bonding Level Description Introduction What is Wire Bonding? Wire bonding is a critical semiconductor manufacturing process that creates electrical connections between integrated circuits (ICs) and their packaging substrates. This wire bonding technique uses ultra-thin bond wires, typically made of gold or aluminum, to establish reliable electrical pathways in microelectronics applications. Understanding Wire Bond Fundamentals A typical wire bond consists of bonded wire connecting a die pad to a substrate pad on a PC board. The bond wire diameter varies between 18 and 50 microns, with 25 microns [...]
GaAs Substrate Thickness Measurement
Semiconductor Gaas Substrate Thickness Measurement Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction:  Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI's Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor's measuring field. Fortunately, MTI has a solution to this problem. Solution:  It’s possible to measure the thickness and TTV of high resistivity semiconducting wafers (like GaAs) using non-contact [...]
Radar Altimeter
Radar Altimeter Customer Case In this RADAR application the customer has pulses coming in at 1660 Hz. For every pulse they need to capture 500 samples which, at that rate, will amount to 1.7 Megs of data every second. The experiment will be running for at least a few minutes. They would then like to log all the captured data to the PC host memory. The final requirement is for the system to be on the PCI bus. By having the system on the PCI bus, the customer can stream the data directly to the PC's memory, which is [...]