Cyber Security Applications
Cyber Security/Cyber Emissions • Side Channel Hardware RF Emissions • Spectrum Monitoring/RF Security Key Factors Related to Cyber Emissions GaGe cyber emission monitoring products support a variety of applications for cyber security. These aspects are interconnected in a variety of ways to support the optimization, safety and security of applications. Cybersecurity in Critical Infrastructure Critical infrastructure sectors, such as energy, government, military, transportation, and healthcare, heavily rely on digital systems and networks. Ensuring the cybersecurity of these systems is crucial to prevent disruptions or malicious attacks [...]
Generator Pole Gap Analysis
Power Generation Generator Pole Gap Analysis Tolerances Description
Vibration / Balancing
Power Generation Vibration / Balancing Amplitude Description
Blade Tip Clearance
Blade Tip Clearance Power Generation Blade Tip Clearance Tolerances Introduction Blade Tip Clearance Solutions for Turbines, Fans, and Rotating Machinery When it comes to turbines and fans, blade tip clearance — the distance between the tip of the blade and the surrounding case — is one of the most crucial measurements. If the blade tips are too close, thermal expansion or vibration could cause destructive contact. If they’re too far, turbine efficiency and performance suffer. That’s why accurately measuring turbine blade tip clearance, fan blade tip clearance, or any [...]
Exploration Of The Elastic Region For Aluminum Alloys
Exploration Of The Elastic Region For Aluminum Alloys Research & Development Exploration Of The Elastic Region For Aluminum Alloys Bending, Tensile and Compression Description One of the most crucial properties of metals, including aluminum alloys, is their elastic characteristics, which define the extent to which a material can deform and return to its original shape once the applied load is removed. This behavior is particularly important when working with materials in engineering and industrial applications, where understanding the elastic region of the stress-strain curve is vital. The stress-strain curve for [...]
Tolerances of Armature Gaps
Tolerances of Armature Gaps Power Generation Tolerances Of Armature Gaps Tolerances Description Introduction In large motors and generators, the air gap needed to separate the revolving rotor from the stator should be as small as possible as this reduces the magnetizing power requirement. The gap also needs to be large enough to prevent contact between the two, despite manufacturing tolerances on their dimensions or movement resulting from mechanical deflection or looseness in supporting bearings. The gap should also be uniform; a non-uniform gap causes increased noise and vibration. Since large [...]
Ultrasonic Horn Vibration
Ultrasonic Horn Vibration Research & Development Ultrasonic Horn Vibration Amplitude Description An "ultrasonic horn" is the device which concentrates this energy and applies it to a process. They come in many different sizes and configurations depending on the task for which they are designed. As the tip of the horn (or contraction area) is brought in contact with a part at a certain pressure, frictional heat is generated causing the material to plasticize locally, creating an insoluble connection between two parts within a very short period of time. As the [...]
Wafer Measurement – Ungrounded
Wafer Measurement - Ungrounded Semiconductor Wafer Measurement - Ungrounded Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
Wafer Thickness, Bow, Warp And TTV
Semiconductor Wafer Thickness, Bow, Warp And Ttv Surface Description Thickness Measurement ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness encountered during a scan pattern or series of point measurements. TTV is expressed in microns or mils (thousandths of an inch). Figure above shows a wafer placed between two non-contact measurement probes. By monitoring changes between the upper probe face [...]
Tape Cartridge Movement
Tape Cartridge Movement Semiconductor Tape Cartridge Movement Positioning Description Researchers are presently working on drives with track widths in the 5 to 1 micron region. For these small widths, tape wander, properly called Lateral Tape Movement (LTM), must be less than 1 micron. This is because the track following head always lags the moving target and produces a position error signal. If the position error signal gets to be larger than about 1/10 the track width, the track cannot be read. However, it follows that the smaller the LTM, the [...]