Ultrasonic Horn Vibration
Ultrasonic Horn Vibration Research & Development Ultrasonic Horn Vibration Amplitude Description An "ultrasonic horn" is the device which concentrates this energy and applies it to a process. They come in many different sizes and configurations depending on the task for which they are designed. As the tip of the horn (or contraction area) is brought in contact with a part at a certain pressure, frictional heat is generated causing the material to plasticize locally, creating an insoluble connection between two parts within a very short period of time. As the [...]
GaGe GaGeScope Download Request
Complete the form below to download GaGeScope. GaGe by Vitrek 900 N. State Street Lockport, IL 60441 Phone: (815) 838-0005 Fax: (815) 838-4424 sales-gage@vitrek.com
GaGe Presale Support Inquiry Form
Complete the form below to request information about GaGe products. GaGe by Vitrek 900 N. State Street Lockport, IL 60441 Phone: (815) 838-0005 Fax: (815) 838-4424 sales-gage@vitrek.com
Wafer Measurement – Ungrounded
Wafer Measurement - Ungrounded Semiconductor Wafer Measurement - Ungrounded Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
GaGe Website Support Inquiry Form
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Wafer Thickness, Bow, Warp And TTV
Semiconductor Wafer Thickness, Bow, Warp And Ttv Surface Description Thickness Measurement ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness encountered during a scan pattern or series of point measurements. TTV is expressed in microns or mils (thousandths of an inch). Figure above shows a wafer placed between two non-contact measurement probes. By monitoring changes between the upper probe face [...]
Tape Cartridge Movement
Tape Cartridge Movement Semiconductor Tape Cartridge Movement Positioning Description Researchers are presently working on drives with track widths in the 5 to 1 micron region. For these small widths, tape wander, properly called Lateral Tape Movement (LTM), must be less than 1 micron. This is because the track following head always lags the moving target and produces a position error signal. If the position error signal gets to be larger than about 1/10 the track width, the track cannot be read. However, it follows that the smaller the LTM, the [...]
GaGe Download Request Form
Complete the form below to request GaGe product download access. GaGe by Vitrek 900 N. State Street Lockport, IL 60441 Phone: (815) 838-0005 Fax: (815) 838-4424 sales-gage@vitrek.com
Wafer QA/QC After Slicing And Polishing
Wafer QA/QC After Slicing And Polishing Semiconductor Wafer Qa/Qc After Slicing And Polishing Surface Description Introduction:When wafers are sliced up with wire saws, they are measured to make sure they are within the specified thickness, with minimal bow, warp, and TTV. After initial measurement, they are sorted and sent for polishing. Since polishing removes material and smoothes out the rough surfaces they need to be measured again to ensure they meet thickness guidelines and quality standards. Solution:MTI Instruments manufactures multiple systems to perform thickness measurements. From semi automated Proforma 300SA to manual [...]
Mobile Devices
Consumer Electronics Mobile Devices Dimensions Description