NUCLEAR HEAT EXCHANGER VIBRATION
Power plants, particularly nuclear power plants, require heat exchangers to cool down the primary working fluid for the power plant. Excessive vibration can lead to cracking and premature failure of the heat exchanger. Problem: A major power plant company approached MTI looking for a sensor that could measure vibration of a heat exchanger assembly that was immersed under water. Additionally, the water could reach 250 F and up to 220 PSI; the probe had to be sealed with a gland at a bulkhead feed through area. Solution: MTI developed a special fiber optic probe based on the MTI-2125H probe configuration. The [...]
Understanding Semiconductor Wafer Stress: A Practical Guide to Thin-Film Stress, Wafer Curvature Measurement & Process Control
Introduction Every semiconductor device begins with a nearly perfect wafer. Yet throughout fabrication, that wafer is repeatedly transformed by dozens of manufacturing processes including thin-film deposition, oxidation, implantation, annealing, polishing, and packaging. While each process is designed to modify the electrical properties of the device, it also alters something far less visible—its mechanical condition. The addition of every thin film introduces internal mechanical forces that can subtly change the shape of the wafer. These changes, often measured in only a few micrometers across a 200 mm or 300 mm substrate, may appear insignificant. However, as semiconductor devices continue to [...]
GaGe on Google Scholar
Visit and View "GaGe Digitizer" on Google Scholar Visit and View "GaGe Applied Technologies" on Google Scholar Google Scholar is a dedicated search site for scholarly literature that includes academic research papers, technical articles, patents, and more. Use the above links to review results of all articles in which GaGe products and services have been cited for various applications in fields such as: Wideband Signal Analysis RADAR Design and Test Signals Intelligence (SIGINT) Ultrasonic Non-Destructive Testing (NDT) LIDAR Systems Communications Optical Coherence Tomography (OCT) Mass Spectroscopy Ultrasound Imaging Time of Flight (TOF) Life Sciences Particle Physics [...]
Whitepaper: Oscilloscopes vs Digitizers: Choosing the Right Platform for Wideband Signal Acquisition
Introduction As signal environments become faster, more complex, and more data-intensive, engineers need acquisition tools that match the demands of modern testing. Whether validating next-generation communications systems, capturing radar pulses, analyzing ultrasound returns, or troubleshooting electronics, the quality of captured data directly impacts design confidence and test accuracy. Two of the most common signal acquisition platforms are oscilloscopes and digitizers. While both sample electrical signals and convert them into digital data, they are designed for different workflows. Oscilloscopes excel in interactive debugging and real-time waveform visualization. Digitizers are optimized for sustained acquisition, deep memory capture, system integration, and high-performance [...]
Application Note: Replace Three Legacy Systems with One: Modernizing Aerospace/Defense Test Cells with PBS eXpress GalleryApplication Note: Replace Three Legacy Systems with One: Modernizing Aerospace/Defense Test Cells with PBS eXpress
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Application Note: Replace Three Legacy Systems with One: Modernizing Aerospace/Defense Test Cells with PBS eXpress
Introduction Many military/defense and commercial aerospace test cells still rely on aging analog instruments that, while functional, introduces risk through calibration challenges, legacy components, and lack of digital data access. As testing demands evolve, the industry is moving toward compact, digital platforms that simplify workflows and improve data usability. A Vitrek customer faced this challenge across multiple engine test cells. Their solution: replace two legacy systems with a single PBS eXpress R+, enabling faster setup, digital data acquisition, and automated reporting. The Challenge The customer’s test cells were built around a mix of aging instrumentation, including TrigTek tracking filters, [...]
Application Note: Why Charge Amplifiers Remain Essential in Aerospace Test Systems
Introduction Many aerospace test programs rely on charge-output piezoelectric accelerometers, force sensors, and dynamic pressure transducers because of their wide frequency response, rugged construction, and ability to capture rapidly changing events. These sensors generate extremely small electrical charge signals—often measured in picocoulombs (pC)—that are susceptible to cable capacitance effects, electrical noise, leakage currents, and environmental influences that can compromise measurement accuracy. Charge amplifiers address these challenges by converting the sensor’s high-impedance charge output into a stable, low impedance voltage signal suitable for transmission, recording, and analysis. By making measurements largely independent of cable capacitance while maintaining low noise, stable [...]
Application Note: Accessing Digital Engine Data for Multi-Platform Aircraft Balancing with MTI PBS Systems GalleryApplication Note: Accessing Digital Engine Data for Multi-Platform Aircraft Balancing with MTI PBS Systems
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Application Note: Accessing Digital Engine Data for Multi-Platform Aircraft Balancing with MTI PBS Systems
Introduction Modern aircraft engines are no longer dependent solely on discrete analog sensors for critical performance data. Increasingly, vibration amplitudes, phase information, and engine speed are transmitted digitally through aircraft data buses such as ARINC 429 and ARINC 664 Part 7 (AFDX). Yet in many MRO environments, balancing systems continue to rely on accelerometers and tachometer pickups—introducing additional setup time, cabling complexity, and potential variability in measurements. This disconnect between available digital data and traditional measurement approaches creates inefficiencies, particularly for facilities servicing multiple aircraft platforms. For organizations supporting a diverse fleet, the opportunity is clear: leverage the aircraft’s [...]
Press Release: MTI Instruments Highlights MRO Benefits of ARINC 429 and AFDX Integration in PBS-4100 Engine Balancing Systems
MTI Instruments Highlights MRO Benefits of ARINC 429 and AFDX Integration in PBS-4100 Engine Balancing Systems Lockport, IL —May 20, 2025— MTI Instruments, a Vitrek brand and provider of precision measurement and aviation maintenance technologies, is highlighting the growing role of digital aircraft data integration in modern maintenance operations following the introduction of ARINC 429 and ARINC 664 (AFDX) support in its PBS-4100 and PBS-4100R engine vibration balancing systems. As commercial aircraft increasingly rely on digital avionics networks for engine monitoring and diagnostics, maintenance teams must be able to access these same data streams during vibration analysis [...]
Press Release: Vitrek Highlights Growing Importance of Wafer Stress Characterization for Advanced Semiconductor Manufacturing GalleryPress Release: Vitrek Highlights Growing Importance of Wafer Stress Characterization for Advanced Semiconductor Manufacturing
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Press Release: Vitrek Highlights Growing Importance of Wafer Stress Characterization for Advanced Semiconductor Manufacturing
Vitrek Highlights Growing Importance of Wafer Stress Characterization for Advanced Semiconductor Manufacturing MTI Instruments Proforma™ non-contact wafer metrology systems help manufacturers optimize thin-film processes, improve process control, and increase production yield. Lockport, IL — July 28, 2026— Vitrek, a leading manufacturer of precision test and measurement equipment, highlighted the growing importance of wafer stress measurement in semiconductor manufacturing as advanced packaging, heterogeneous integration, silicon carbide (SiC), gallium nitride (GaN), MEMS, and photonics applications continue to drive demand for tighter process control, improved manufacturing consistency, and higher device reliability. As semiconductor manufacturing processes become increasingly complex, engineers are [...]
News Release: Vitrek Highlights Critical Role of Wafer Thickness Metrology in AI and Advanced Packaging Manufacturing GalleryNews Release: Vitrek Highlights Critical Role of Wafer Thickness Metrology in AI and Advanced Packaging Manufacturing
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News Release: Vitrek Highlights Critical Role of Wafer Thickness Metrology in AI and Advanced Packaging Manufacturing
Vitrek Highlights Growing Importance of Wafer Stress Characterization for Advanced Semiconductor Manufacturing MTI Instruments Proforma systems help semiconductor manufacturers monitor backside processing for HBM, chiplets and next-generation computing devices LOCKPORT, Il — September 23, 2026 — Vitrek is highlighting the growing importance of precision wafer-thickness measurement as semiconductor manufacturers expand production of GPU/AI Engines, high-bandwidth memory, Traditional CPUs, Programmable logic, and Power Semiconductors. Advanced packaging technologies combine logic, memory, interposers and specialized dies within tightly controlled structures. To meet package-height and integration requirements, wafers often undergo backside grinding, polishing and other thinning operations. As wafers become thinner, [...]