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Editorials

Automating Complex Cable Testing with the Vitrek V10X and 964i

Introduction Cable assemblies are no longer simple pass/fail products. Modern harnesses may contain dozens—or hundreds—of conductors, shielding paths, insulation systems, and termination points. Testing them manually is slow, labor intensive, and prone to inconsistency. The combination of the Vitrek V10X Hipot Tester and Vitrek 964i High Voltage Switching System creates a modern automated platform for validating cable safety and integrity with higher speed and repeatability. The Challenge Manufacturers of advanced cable assemblies are under constant pressure to improve quality while keeping production moving. Many products now use large pin-count connectors and complex multi-conductor designs that require access to numerous [...]

Application Note: Modernizing a Legacy Military Avionics Test System with a Programmable GaGe High-Speed Digitizer

Introduction Across military and aerospace maintenance operations, many proven test systems remain in service decades after their original deployment. These systems often support critical certification procedures, validated workflows, and platform-specific compliance tests that are costly or impractical to replace. While the airframes and missions may evolve, the test infrastructure built around them often remains indispensable. The challenge arises when key instruments inside those systems become obsolete. Aging oscilloscopes, digitizers, controllers, and interface hardware can create maintenance burdens, calibration issues, and long-term support risks. Replacing them is rarely simple. In regulated or mission-critical environments, a modern instrument must not only [...]

By |May 4th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Application Note: Modernizing a Legacy Military Avionics Test System with a Programmable GaGe High-Speed Digitizer

Brake Rotors

Industry Automotive Applications Brake Rotors Measurement Type Surface Description Under normal operating conditions brake rotors are subjected to extreme temperatures and forces, which can cause rotor distortion and potential failure. To make certain it can withstand these conditions; extensive laboratory testing is performed to optimize design for longevity, short stopping distance, and vibration free operation. Extensive on-vehicle testing is done under real life conditions to test prototype units and engineering designs. Test vehicles are driven for long periods of time while brake performance is monitored by a variety of sensors [...]

By |January 5th, 2023|Comments Off on Brake Rotors

Application Note: Improving Optical Measurements Through High-Speed Data Acquisition

Introduction Advances in optical engineering are driving the need for faster, more accurate data acquisition systems. Whether characterizing laser pulses, measuring fiber optic sensors, or analyzing highspeed optical communications, today’s photonics applications generate electrical signals that demand exceptional sampling performance and timing accuracy. While the optical source may be light, the measurement ultimately depends on capturing an electrical waveform produced by a photodiode or other optical detector. Preserving the integrity of that waveform is critical, as lost detail or timing errors can directly affect measurement accuracy, image quality, or system performance. High-speed PCIe digitizers provide the bandwidth, memory depth, [...]

By |July 10th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Application Note: Improving Optical Measurements Through High-Speed Data Acquisition

GLASS THICKNESS

Industry Consumer Electronics Applications Glass Thickness Measurement Type Thickness Description Did you know that glass thickness can be measured with a capacitance probe? You will need some equipment: Digital Accumeasure D200 ASP-2500-CTA Dielectric probe (The capacitance probe has a sensing area of 11.25 mm) Range extension = 3X, 10Hz filter Introduction: An industrial glass fabricator needed a way to determine the thickness of glass, before cutting it to shape and coating it. The glass sample was marked with indices to find the measuring points. The sample center point -5- thickness was checked [...]

By |January 4th, 2023|Comments Off on GLASS THICKNESS

Whitepaper: Choosing the Right Data Acquisition Architecture for Photonics Applications

Introduction Photonics has become one of the fastest-growing fields in engineering, enabling advances in autonomous vehicles, optical communications, medical imaging, aerospace, semiconductor manufacturing, and quantum technologies. As these systems continue to evolve, engineers are challenged to capture increasingly complex optical signals while maintaining exceptional measurement accuracy, repeatability, and timing precision. At the heart of every optical measurement system is a detector that converts light into an electrical signal. The quality of the resulting data depends not only on the detector itself, but also on the architecture used to acquire, process, and analyze that signal. Selecting the appropriate data acquisition [...]

By |July 10th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Whitepaper: Choosing the Right Data Acquisition Architecture for Photonics Applications

Application Note: Wafer & Thin-Film Stress Characterization Using the Proforma 300iSA

Introduction Thin films are essential to modern semiconductor devices, but every deposited, grown, bonded, or processed layer can introduce mechanical stress into the wafer. When that stress becomes excessive or inconsistent, the effects can extend well beyond the deposition step—contributing to wafer bow, cracking, delamination, overlay error, handling problems, yield loss, and downstream process instability. The MTI Instruments Proforma™ 300iSA semi-automated metrology system provides the full-wafer thickness and shape data needed to evaluate these risks. By measuring wafer geometry before and after a process step, engineers can quantify curvature change and use established film-stress relationships to calculate and trend [...]

By |July 23rd, 2026|Categories: Application Notes-MTI, Industry-Semiconductor, Industry-Semiconductor-MTI, New & Press Releases|Comments Off on Application Note: Wafer & Thin-Film Stress Characterization Using the Proforma 300iSA

HEIGHT GAP OF INKJET PRINTERS

Industry Consumer Electronics Applications Height Gap Of Inkjet Printers Measurement Type Positioning Description Introduction:  Inkjet printers require a certain distance between the inkjet print head and the paper. If the distance is set incorrectly, the printed images get blurry. Current state of the art printers have the print head nozzles built right into the bottom of the ink reservoir (B) as shown below. When the ink cartridge is installed in the printer, the inkjet nozzles (made out of silicon) essentially become a grounded target through the connections shown at [...]

By |January 4th, 2023|Comments Off on HEIGHT GAP OF INKJET PRINTERS

Whitepaper: Thickness Metrology for AI Accelerators, HBM and Chiplet-Based Advanced Packaging

Introduction Artificial intelligence and high-performance computing are reshaping semiconductor design and manufacturing. Instead of relying exclusively on increasingly large monolithic devices, manufacturers are integrating logic, memory and specialized functions through chiplets, 2.5D packaging, 3D stacking and high-bandwidth memory. These architectures improve computing density, bandwidth and energy efficiency, but they also place greater demands on wafer thinning and backside processing. Individual wafers and dies may need to be made significantly thinner before stacking, bonding or package assembly. As thickness decreases, however, wafers become more susceptible to breakage, warpage, handling damage and non-uniform material removal. Thickness metrology therefore becomes more than [...]

By |September 25th, 2026|Categories: Industry-Semiconductor, Industry-Semiconductor-MTI, New & Press Releases, Whitepapers-MTI|Comments Off on Whitepaper: Thickness Metrology for AI Accelerators, HBM and Chiplet-Based Advanced Packaging

Engine Balancing in the Digital Age: Unlocking Faster, Smarter MRO with Integrated Aircraft Data

Introduction Modern aircraft engines generate vast amounts of operational data, yet much of this information has historically remained under utilized during maintenance procedures like vibration balancing. As fleets transition to digitally connected avionics architectures, MRO teams are rethinking how they access and apply engine data to improve efficiency and accuracy. By leveraging direct integration with onboard data networks, today’s vibration balancing systems can streamline setup, reduce dependency on external instrumentation, and deliver faster, more reliable results—ultimately helping operators minimize downtime and maintain peak engine performance. The Role of Engine Vibration Balancing MRO Jet engines operate under extreme mechanical stress, [...]

By |May 6th, 2026|Categories: Articles-MTI, Industry-Aerospace, Industry-Government/Military, Whitepapers-MTI|Comments Off on Engine Balancing in the Digital Age: Unlocking Faster, Smarter MRO with Integrated Aircraft Data
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