Press Release: Vitrek 4700 Makes Compliance with Global ISO 17025 Voltage Standards Simpler & Less Costly
Vitrek 4700 Makes Compliance with Global ISO 17025 Voltage Standards Simpler & Less Costly Product’s Diverse Capabilities & Built-In Compliance Simplify Set-up and Cut Out $2,000+ in Upfront Calibration Costs. Lockport, IL, - December 4, 2025– Vitrek’s 4700 Precision High Voltage Meter is gaining recognition as the simplest deployment-ready solution for laboratories looking to achieve ISO/IEC 17025—a compliance requirement needed for a growing number of medical device, aerospace, and energy devices worldwide. This comes as the global test and measurement market, valued at $38.9 billion in 2024, is experiencing accelerated growth driven by compliance requirements. * [...]
Capacitance Sensors Track Brake Rotor Thickness Variation
[Application Note 51018] Today’s cars and trucks offer unprecedented fuel efficiencies and handling characteristics – thanks, in part, to vehicle lightweighting. Applied to all vehicle components, lightweighting lowers stress and strain to improve mileage and boost overall performance. In keeping with this trend, today’s brake rotors are thinner and lighter than those of just a few years ago. In addition, many feature cooling vents to further improve performance. These changes, however, reduce available braking surface, forcing automotive engineers to consider alternative materials and designs. Problem Because the extreme temperatures and forces generated during braking can easily lead to rotor [...]
LED SUBSTRATE THICKNESS
Industry Semiconductor Applications Photolithography Using Capacitance Sensors Measurement Type Positioning Description Remember that old acronym, GIGO? Garbage in garbage out, it can apply to raw materials as well as programming. Sapphire wafers need to be of a certain quality to ensure maximum yield. Excessive TTV, Bow, and Warp lead to premature LED failure. LED manufacturers need to inspect incoming wafers. Wafer producers also need to check and control TTV, Bow and Warp. The market for sapphire wafers, driven by the growth in LED manufacturing, is booming. While the price [...]
Press Release: MTI’s Proforma 300iSA Combines SEMI and ASTM Standard Compliance in Space-Efficient Benchtop Design GalleryPress Release: MTI’s Proforma 300iSA Combines SEMI and ASTM Standard Compliance in Space-Efficient Benchtop Design
Industry-Semiconductor-MTI, New & Press Releases, News, News-MTI-Instrumentation, Press Releases, Press Releases-MTI
Press Release: MTI’s Proforma 300iSA Combines SEMI and ASTM Standard Compliance in Space-Efficient Benchtop Design
MTI's Proforma 300iSA Combines SEMI and ASTM Standard Compliance in Space-Efficient Benchtop Design The Proforma 300iSA combines ASTM and SEMI standard measurements in a compact, desktop system for flexible semiconductor metrology. Lockport, IL, November 18, 2025 – Vitrek, a leading U.S. designer of precision measurement systems, has introduced the MTI Instruments Proforma 300iSA Semi-Automated Metrology System. The benchtop system delivers full SEMI and ASTM compliance in a compact footprint—offering laboratory-grade precision without the space demands of traditional floor-mounted equipment. “The Proforma 300iSA represents a fundamental shift in how manufacturers approach precision metrology,” said Todd Stukenberg, President at [...]
Ultra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011 GalleryUltra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011
Application Notes-Vitrek, Brand-Vitrek, Industry-Compliance Testing, Industry-Electronics, Industry-Manufacturing, Industry-Measurement Applications, Whitepapers-Vitrek
Ultra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011
Application Note: Ultra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011 Introduction Electronic devices sold in energy-conscious markets must meet strict standby and off-mode power limits as defined by standards like IEC62301 and EN50564:2011. This application note shows how Vitrek’s PA920 Series Precision Power Analyzers deliver accurate and repeatable measurements — often in the milliwatt range — fully aligned with EN50564:2011. The PA920 provides superior low-current measurement range, high-resolution digitizing, and configurable triggering, making it ideal for capturing stable and unstable (mode-switching) standby loads with confidence. Measurement Challenges & EN50564 Requirements The Vitrek PA920 precision [...]
Press Release: Vitrek Breakthrough: Time-Saving MTI “Trim Balance Wizard” Now Available for Mid-Frame Jet Engine MROs GalleryPress Release: Vitrek Breakthrough: Time-Saving MTI “Trim Balance Wizard” Now Available for Mid-Frame Jet Engine MROs
Industry-Aerospace, Industry-Government/Military, New & Press Releases, News-All Brands, News-MTI-PBS, News-Product Updates, Press Releases-MTI
Press Release: Vitrek Breakthrough: Time-Saving MTI “Trim Balance Wizard” Now Available for Mid-Frame Jet Engine MROs
Vitrek Breakthrough: Time-Saving MTI “Trim Balance Wizard” Available for Mid-Frame Jet Engine MROs Innovative Trim Balance Wizard Enables Fast Turbine Balancing by Novice Technicians. Lockport, IL—November 5, 2025 — Vitrek, LLC, a maker of high- precision measurement equipment, has integrated the MTI Trim Balance Wizard, an advanced guided-balancing interface into its PBS eXpress turbine vibration and balancing system for smaller frame jet engines. The Trim Balance Wizard functionality was previously only available to large jet makers and MROs as part of the standard PBS product line. Now incorporated into the PBS eXpress this same labor-saving technology is [...]
PIEZO STAGE POSITIONING
Industry Consumer Electronics Applications Piezo Stage Measurement Type Positioning Description Positioning stages using piezoelectric stack actuators (PEA) have very high resolution. However, it is difficult to achieve precise dynamic motion tracking using traditional linear controllers such as PID due to the inherent hysteresis nonlinearity of piezoelectric materials and the phase lag associated with such controllers. Capacitance Sensors are ideal for measuring the actual piezo stage position and correcting for the inherent nonlinearity through closed loop feedback. They have the stability, bandwidth and high resolution needed to do the job. [...]
Press Release: Vitrek, LLC Appoints Todd J. Stukenberg as President
Vitrek, LLC Appoints Todd J. Stukenberg as President Lockport, IL, October 22, 2025— Vitrek, LLC (“Vitrek”), a leading provider of high-performance industrial test and measurement equipment, is pleased to announce the appointment of Todd J. Stukenberg as its new President. Stukenberg brings more than 20 years of experience in advanced testing and measurement, along with a proven track record in global marketing program development and execution, talent management, and strategic planning. In his new role, Stukenberg will focus on driving growth across key industries—including semiconductors and aerospace—by leveraging Vitrek’s portfolio of innovative and complementary brands: Vitrek, MTI [...]
WAFER QA/QC AFTER SLICING AND POLISHING
Industry Semiconductor Applications Wafer Qa/Qc After Slicing And Polishing Measurement Type Surface Description When wafers are sliced up with wire saws, they are measured to make sure they are within the specified thickness, with minimal bow, warp, and TTV. After initial measurement, they are sorted and sent for polishing. Since polishing removes material and smoothes out the rough surfaces they need to be measured again to ensure they meet thickness guidelines and quality standards. Solution: MTI Instruments manufactures multiple systems to perform thickness measurements. From semi automated Proforma 300SA to manual wafer [...]
ABOUT WAFER BOW AND WARP MEASUREMENT SYSTEMS
Thickness Measurement for Metrology Systems ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness encountered during a scan pattern or series of point measurements. TTV is expressed in microns or mils (thousandths of an inch). ASTM F534 3.1.2: The deviation of the center point of the median surface of a free, unclamped wafer from the median [...]