How to Achieve <1um Accuracy When Measuring Roller Gap Roller Gap Measurement with MTI Digital Accumeasure Capacitive Probes Many roll-to-roll finishing processes typically use a calender, or series of hard pressure rollers, to deliver smooth, high-quality products of plastic, textile, or paper (Fig 1). Ensuring a consistent material thickness, however, depends on the ability [...]
A Comprehensive Guide to Non-Contact Sensors and Their ApplicationsSensors, both contact and non-contact, are crucial devices that allow the monitoring, detection, and reaction to conditions in an environment or within a process or piece of equipment. While myriad types of sensors exist and are designed to monitor varying conditions, all of them can be characterized [...]
This is the third of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The second article examines the cost of failing to inspect semiconductor wafers. Fully automated systems that can load, scan, and unload wafers are fast, convenient, and efficient at high [...]
This is the first of three articles in Semiconductor Wafer Measurement for Increased Profitability. The second article examines the cost of failing to inspect semiconductor wafers. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. [...]
Why Demand for SiC Wafers is Hot and Durable Pardon the pun, but SiC wafers are a hot item for high-temperature applications. Silicone carbide (SiC), a semiconductor containing both silicon and carbide, withstands temperatures up to 2700°C. Carborundum, as this durable ceramic is also known, finds additional applications in bulletproof vests, extrusion dies, sandpaper, [...]
Wafer Stress Analysis Using MTI Instruments Proforma 300iSAWafer processing involves several stages that may translate into mechanical alterations. Sometimes these alterations can cause deformities that render the wafer either unusable or that put it marginally close to not being usable. To determine this, stress analysis can be used.The Proforma 300iSA wafer characterization tool provides a [...]
Wafer backgrinding is the first step in semiconductor packaging, the process of encasing one or more discrete semiconductor devices or integrated circuits (IC) for protection. Known also as wafer thinning or wafer lapping, backgrinding reduces wafer thickness to allow stacking and high-density IC packaging. Wafer thickness also determines package height, an important consideration as [...]
High resolution applications do not always require an interferometer. If you want to make accurate measurements in the micron to picometer range, then an MTI Digital Accumeasure D100 HD or D200 system may be what you need. Laser interferometers can sell for more than $15,000 and be difficult to setup. For example, you may [...]
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