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Application Note: Monitoring Wafer Thickness During Backside Processing for AI and Advanced Packaging

Introduction AI accelerators, high-performance computing systems, high bandwidth memory and chiplet-based devices increasingly rely on 2.5D and 3D advanced packaging processes that combine logic, memory, interposers and specialized dies within tightly controlled structures. Before stacking or bonding, wafers may undergo coarse grinding, fine grinding, polishing and other backside processes. These operations must remove substantial material while maintaining the thickness and geometry required by the package design. This application note explains how the MTI Instruments Proforma 300i and Proforma 300iSA can be used at defined process checkpoints to verify wafer thickness, evaluate uniformity and identify process changes before wafers proceed [...]

By |September 25th, 2026|Categories: Application Notes-MTI, Industry-Semiconductor, Industry-Semiconductor-MTI, New & Press Releases|Comments Off on Application Note: Monitoring Wafer Thickness During Backside Processing for AI and Advanced Packaging

Whitepaper: The Future of Cable Testing: Why Intelligent Automation is Replacing Manual Validation

Introduction Cable assemblies are evolving rapidly as products become more compact, more powerful, and more connected. Today’s designs often operate at higher voltages while fitting into smaller packaging envelopes, forcing engineers to balance electrical performance with limited physical space. At the same time, many assemblies now include a greater number of conductors and increasingly combine mixed signal and power paths within a single harness. Environmental demands are also rising. Cable systems may need to withstand vibration, temperature extremes, moisture, chemicals, or continuous motion depending on the application. Alongside these technical requirements, manufacturers face growing expectations for stronger quality documentation [...]

By |May 21st, 2026|Categories: Brand-Vitrek, Industry-Aerospace, Industry-Automotive, Industry-Cable Test, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Government/Military, Industry-Lighting, Industry-Manufacturing, Industry-Medical, New & Press Releases, Whitepapers-Vitrek|Comments Off on Whitepaper: The Future of Cable Testing: Why Intelligent Automation is Replacing Manual Validation

Application Note: Modernizing a Legacy Military Avionics Test System with a Programmable GaGe High-Speed Digitizer

Introduction Across military and aerospace maintenance operations, many proven test systems remain in service decades after their original deployment. These systems often support critical certification procedures, validated workflows, and platform-specific compliance tests that are costly or impractical to replace. While the airframes and missions may evolve, the test infrastructure built around them often remains indispensable. The challenge arises when key instruments inside those systems become obsolete. Aging oscilloscopes, digitizers, controllers, and interface hardware can create maintenance burdens, calibration issues, and long-term support risks. Replacing them is rarely simple. In regulated or mission-critical environments, a modern instrument must not only [...]

By |May 4th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Application Note: Modernizing a Legacy Military Avionics Test System with a Programmable GaGe High-Speed Digitizer

Application Note: Improving Optical Measurements Through High-Speed Data Acquisition

Introduction Advances in optical engineering are driving the need for faster, more accurate data acquisition systems. Whether characterizing laser pulses, measuring fiber optic sensors, or analyzing highspeed optical communications, today’s photonics applications generate electrical signals that demand exceptional sampling performance and timing accuracy. While the optical source may be light, the measurement ultimately depends on capturing an electrical waveform produced by a photodiode or other optical detector. Preserving the integrity of that waveform is critical, as lost detail or timing errors can directly affect measurement accuracy, image quality, or system performance. High-speed PCIe digitizers provide the bandwidth, memory depth, [...]

By |July 10th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Application Note: Improving Optical Measurements Through High-Speed Data Acquisition

Whitepaper: Choosing the Right Data Acquisition Architecture for Photonics Applications

Introduction Photonics has become one of the fastest-growing fields in engineering, enabling advances in autonomous vehicles, optical communications, medical imaging, aerospace, semiconductor manufacturing, and quantum technologies. As these systems continue to evolve, engineers are challenged to capture increasingly complex optical signals while maintaining exceptional measurement accuracy, repeatability, and timing precision. At the heart of every optical measurement system is a detector that converts light into an electrical signal. The quality of the resulting data depends not only on the detector itself, but also on the architecture used to acquire, process, and analyze that signal. Selecting the appropriate data acquisition [...]

By |July 10th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Whitepaper: Choosing the Right Data Acquisition Architecture for Photonics Applications

Application Note: Wafer & Thin-Film Stress Characterization Using the Proforma 300iSA

Introduction Thin films are essential to modern semiconductor devices, but every deposited, grown, bonded, or processed layer can introduce mechanical stress into the wafer. When that stress becomes excessive or inconsistent, the effects can extend well beyond the deposition step—contributing to wafer bow, cracking, delamination, overlay error, handling problems, yield loss, and downstream process instability. The MTI Instruments Proforma™ 300iSA semi-automated metrology system provides the full-wafer thickness and shape data needed to evaluate these risks. By measuring wafer geometry before and after a process step, engineers can quantify curvature change and use established film-stress relationships to calculate and trend [...]

By |July 23rd, 2026|Categories: Application Notes-MTI, Industry-Semiconductor, Industry-Semiconductor-MTI, New & Press Releases|Comments Off on Application Note: Wafer & Thin-Film Stress Characterization Using the Proforma 300iSA

Whitepaper: Thickness Metrology for AI Accelerators, HBM and Chiplet-Based Advanced Packaging

Introduction Artificial intelligence and high-performance computing are reshaping semiconductor design and manufacturing. Instead of relying exclusively on increasingly large monolithic devices, manufacturers are integrating logic, memory and specialized functions through chiplets, 2.5D packaging, 3D stacking and high-bandwidth memory. These architectures improve computing density, bandwidth and energy efficiency, but they also place greater demands on wafer thinning and backside processing. Individual wafers and dies may need to be made significantly thinner before stacking, bonding or package assembly. As thickness decreases, however, wafers become more susceptible to breakage, warpage, handling damage and non-uniform material removal. Thickness metrology therefore becomes more than [...]

By |September 25th, 2026|Categories: Industry-Semiconductor, Industry-Semiconductor-MTI, New & Press Releases, Whitepapers-MTI|Comments Off on Whitepaper: Thickness Metrology for AI Accelerators, HBM and Chiplet-Based Advanced Packaging

Whitepaper: Oscilloscopes vs Digitizers: Choosing the Right Platform for Wideband Signal Acquisition

Introduction As signal environments become faster, more complex, and more data-intensive, engineers need acquisition tools that match the demands of modern testing. Whether validating next-generation communications systems, capturing radar pulses, analyzing ultrasound returns, or troubleshooting electronics, the quality of captured data directly impacts design confidence and test accuracy. Two of the most common signal acquisition platforms are oscilloscopes and digitizers. While both sample electrical signals and convert them into digital data, they are designed for different workflows. Oscilloscopes excel in interactive debugging and real-time waveform visualization. Digitizers are optimized for sustained acquisition, deep memory capture, system integration, and high-performance [...]

By |May 4th, 2026|Categories: Brand-GaGe, New & Press Releases, Whitepapers-GaGe|Comments Off on Whitepaper: Oscilloscopes vs Digitizers: Choosing the Right Platform for Wideband Signal Acquisition

Application Note: Replace Three Legacy Systems with One: Modernizing Aerospace/Defense Test Cells with PBS eXpress

Introduction Many military/defense and commercial aerospace test cells still rely on aging analog instruments that, while functional, introduces risk through calibration challenges, legacy components, and lack of digital data access. As testing demands evolve, the industry is moving toward compact, digital platforms that simplify workflows and improve data usability. A Vitrek customer faced this challenge across multiple engine test cells. Their solution: replace two legacy systems with a single PBS eXpress R+, enabling faster setup, digital data acquisition, and automated reporting. The Challenge The customer’s test cells were built around a mix of aging instrumentation, including TrigTek tracking filters, [...]

By |March 19th, 2026|Categories: Application Notes-MTI, Brand-MTI, Industry-Aerospace, New & Press Releases, News-Industry, News-MTI, Whitepapers-MTI|Comments Off on Application Note: Replace Three Legacy Systems with One: Modernizing Aerospace/Defense Test Cells with PBS eXpress

Application Note: Why Charge Amplifiers Remain Essential in Aerospace Test Systems

Introduction Many aerospace test programs rely on charge-output piezoelectric accelerometers, force sensors, and dynamic pressure transducers because of their wide frequency response, rugged construction, and ability to capture rapidly changing events. These sensors generate extremely small electrical charge signals—often measured in picocoulombs (pC)—that are susceptible to cable capacitance effects, electrical noise, leakage currents, and environmental influences that can compromise measurement accuracy. Charge amplifiers address these challenges by converting the sensor’s high-impedance charge output into a stable, low impedance voltage signal suitable for transmission, recording, and analysis. By making measurements largely independent of cable capacitance while maintaining low noise, stable [...]

By |June 25th, 2026|Categories: Application Notes-MTI, Brand-MTI, Industry-Aerospace, New & Press Releases, News-Industry, News-MTI, Whitepapers-MTI|Comments Off on Application Note: Why Charge Amplifiers Remain Essential in Aerospace Test Systems
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