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Industry-Manufacturing

Choosing the Right Hipot Platform for Modern Manufacturing Electrical Safety Testing

Introduction Electrical safety testing has evolved from a standalone bench task into a critical, integrated part of modern manufacturing and product validation. As products become more complex — and production environments more automated — the choice of a hipot tester is no longer just about voltage range or leakage resolution. It’s about scalability, integration, data, and long-term flexibility. Vitrek’s V7X, 95X and the newest V10X series hipot testers represent three distinct approaches to electrical safety testing, each aligned with different stages of manufacturing maturity and operational needs. From Entry-Level Testing to Production Confidence For many organizations, electrical safety testing [...]

Enabling Intelligent, Automation-Ready Electrical Safety Testing in Modern Production

Application Note: Enabling Intelligent, Automation-Ready Electrical Safety Testing in Modern Production Introduction As manufacturing environments evolve toward Industry 4.0, electrical safety testing can no longer operate as a standalone, manual process. Modern production lines demand seamless automation integration, high throughput, traceable data, and uncompromised measurement integrity. Hipot testing—critical for verifying  insulation strength and operator safety—must now function as a synchronized element within fully connected manufacturing ecosystems. The Vitrek 95X Series Hipot Testers and Vitrek V7X Series Hipot Testers are engineered specifically for this environment. With programmable sequencing, rapid execution speeds, and native automation interfaces, these platforms transform traditional [...]

By |February 6th, 2026|Categories: Application Notes-Vitrek, Brand-Vitrek, Industry-Compliance Testing, Industry-Electronics, Industry-Manufacturing, Industry-Measurement Applications, Whitepapers-Vitrek|Comments Off on Enabling Intelligent, Automation-Ready Electrical Safety Testing in Modern Production

Testing Energy-Efficient Washing Machines with the PA900 Power Analyzer

Application Note: Testing Energy-Efficient Washing Machines with the PA900 Power Analyzer Introduction Today’s consumers demand home appliances that use less energy and water. Washing machines are no exception. Manufacturers must meet strict energy labeling standards and provide proof that their products are truly efficient. This means accurate, repeatable measurements of electrical power and energy use throughout a full wash cycle are essential. The Vitrek PA900 Power Analyzer is an ideal tool for this task. Testing Challenges Testing a washing machine for energy efficiency isn’t as simple as reading its average power draw. Wash cycles can last over an [...]

By |December 23rd, 2025|Categories: Application Notes-Vitrek, Brand-Vitrek, Industry-Compliance Testing, Industry-Electronics, Industry-Manufacturing, Industry-Measurement Applications, Whitepapers-Vitrek|Comments Off on Testing Energy-Efficient Washing Machines with the PA900 Power Analyzer

LED SUBSTRATE THICKNESS

Industry Semiconductor Applications Photolithography Using Capacitance Sensors Measurement Type Positioning Description Remember that old acronym, GIGO?  Garbage in garbage out, it can apply to raw materials as well as programming. Sapphire wafers need to be of a certain quality to ensure maximum yield. Excessive TTV, Bow, and Warp lead to premature LED failure. LED manufacturers need to inspect incoming wafers. Wafer producers also need to check and control TTV, Bow and Warp. The market for sapphire wafers, driven by the growth in LED manufacturing, is booming. While the price [...]

By |January 25th, 2023|Comments Off on LED SUBSTRATE THICKNESS

Ultra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011

Application Note: Ultra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011 Introduction Electronic devices sold in energy-conscious markets must meet strict standby and off-mode power limits as defined by standards like IEC62301 and EN50564:2011. This application note shows how Vitrek’s PA920 Series Precision Power Analyzers deliver accurate and repeatable measurements — often in the milliwatt range — fully aligned with EN50564:2011. The PA920 provides superior low-current measurement range, high-resolution digitizing, and configurable triggering, making it ideal for capturing stable and unstable (mode-switching) standby loads with confidence. Measurement Challenges & EN50564 Requirements The Vitrek PA920 precision [...]

By |November 11th, 2025|Categories: Application Notes-Vitrek, Brand-Vitrek, Industry-Compliance Testing, Industry-Electronics, Industry-Manufacturing, Industry-Measurement Applications, Whitepapers-Vitrek|Comments Off on Ultra-Low Standby Power Testing Made Simple with Vitrek Power Analyzers and EN50564:2011

PIEZO STAGE POSITIONING

Industry Consumer Electronics Applications Piezo Stage Measurement Type Positioning Description Positioning stages using piezoelectric stack actuators (PEA) have very high resolution. However, it is difficult to achieve precise dynamic motion tracking using traditional linear controllers such as PID due to the inherent hysteresis nonlinearity of piezoelectric materials and the phase lag associated with such controllers. Capacitance Sensors are ideal for measuring the actual piezo stage position and correcting for the inherent nonlinearity through closed loop feedback. They have the stability, bandwidth and high resolution needed to do the job. [...]

By |January 10th, 2023|Comments Off on PIEZO STAGE POSITIONING

GAAS SUBSTRATE THICKNESS MEASUREMENT

Industry Semiconductor Applications Gaas Substrate Thickness Measurement Measurement Type Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction: Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI’s Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor’s measuring field. Fortunately, MTI has a solution to this problem. Solution: It’s possible to measure the thickness and TTV of high resistivity semiconducting wafers (like GaAs) using non-contact capacitive [...]

By |January 26th, 2023|Comments Off on GAAS SUBSTRATE THICKNESS MEASUREMENT

Compliance Testing of Harmonic Current Emissions According to IEC61000-3-2 and IEC61000-3-12.

Compliance Testing of Harmonic Current Emissions According to IEC61000-3-2 and IEC61000-3-12. Using the Vitrek PA900 Precision Harmonic Power Analyzer Introduction Compliance with electromagnetic compatibility (EMC) standards is mandatory for electrical and electronic equipment sold in many global markets. Among these, the IEC61000-3-2 and IEC61000-3-12 standards specify limits for harmonic current emissions of equipment connected to low-voltage public supply systems. These limits ensure that individual devices do not contribute excessively to harmonic distortion on the power grid, which can lead to overheating in transformers, nuisance tripping of breakers, and interference with other equipment. The Vitrek PA900 Precision Power [...]

By |September 24th, 2025|Categories: Application Notes-Vitrek, Brand-Vitrek, Industry-Automotive, Industry-Compliance Testing, Industry-Consumer Products, Industry-Energy, Industry-Manufacturing, Industry-Medical, Industry-Medical, Industry-OEM, Industry-R&D, Industry-Semiconductor, News-All Brands, Products-Vitrek-Power-Analyzer|Comments Off on Compliance Testing of Harmonic Current Emissions According to IEC61000-3-2 and IEC61000-3-12.

Spindle Run Out

Industry Automotive Applications Spindle Run Out Measurement Type Positioning Description Rotating targets frequently have an intermittent, uncertain or nonexistent ground path. This introduces unwanted noise, instability, drift and reduces accuracy of the measurement. MTI Instruments offers a unique “Push-Pull” capacitance measurement system that does not require a grounded target. It utilizes two probes, built into one body, that work together to complete the ground path. One probe pushes current into the brake rotor while the adjacent probe pulls the current out. The result is a “clean”, consistent electrical sensing path. As the [...]

By |January 26th, 2023|Comments Off on Spindle Run Out

CAPACITANCE SENSORS FACILITATE 3D IC CONSTRUCTION

[Application Note 70518] To boost device performance, today’s semiconductor and microelectronics manufacturers are building three-dimensional integrated circuits featuring vertically-stacked silicon wafers and dies. The rationale is simple. Exploiting the Z-axis avoids the power and footprint penalties associated with two-dimensional processes. Implementing the rationale, however, is not so simple. Going vertical requires coplanar surfaces to make contact with all pins, pads, and pillars. Problem Typically, manufacturers measure the angle and gap between two planes to determine coplanarity. Bonding tool actuators rely on these angle/gap measurements to adjust components and make sure all device pins and/or solder balls reside on the [...]

By |January 30th, 2023|Comments Off on CAPACITANCE SENSORS FACILITATE 3D IC CONSTRUCTION
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