Sheet Metal Monitoring
Sheet Metal Monitoring Automotive Sheet Metal Monitoring Thickness Description Introduction: When sheet metal is formed in a continuous process it needs monitoring during the actual feed prior to machining or forming to prevent defects and scrap.  One way to accomplish this is to use a laser sensor to measure the thickness. Problem: A major electrical equipment manufacturer needed a way to monitor the incoming material just prior to shearing and forming. The device needed to be robust, non-contact, reliable, accurate, and fast. The client would be using their data acquisition [...]
Wire Bonding
Wire Bonding Semiconductor Wire Bonding Level Description Introduction What is Wire Bonding? Wire bonding is a critical semiconductor manufacturing process that creates electrical connections between integrated circuits (ICs) and their packaging substrates. This wire bonding technique uses ultra-thin bond wires, typically made of gold or aluminum, to establish reliable electrical pathways in microelectronics applications. Understanding Wire Bond Fundamentals A typical wire bond consists of bonded wire connecting a die pad to a substrate pad on a PC board. The bond wire diameter varies between 18 and 50 microns, with 25 microns [...]
GaAs Substrate Thickness Measurement
Semiconductor Gaas Substrate Thickness Measurement Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction:  Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI's Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor's measuring field. Fortunately, MTI has a solution to this problem. Solution:  It’s possible to measure the thickness and TTV of high resistivity semiconducting wafers (like GaAs) using non-contact [...]
Photolithography Using Capacitance Sensors
Photolithography Using Capacitance Sensors Semiconductor Photolithography Using Capacitance Sensors Positioning Description When it comes to photolithography, how accurate are our sensors? Accurate enough to measure this: ​   Photo by D. Carr and H. Craighead, Cornell The world's smallest guitar is 10 micrometers long -- about the size of a single cell -- with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]
Hard Drive Position
Semiconductor Hard Drive Position Positioning Description
LED Substrate Thickness
LED Substrate Thickness Semiconductor Led Substrate Thickness Thickness Description Remember that old acronym, GIGO?  Garbage in garbage out, it can apply to raw materials as well as programming. Sapphire wafers need to be of a certain quality to ensure maximum yield. Excessive TTV, Bow, and Warp lead to premature LED failure. LED manufacturers need to inspect incoming wafers. Wafer producers also need to check and control TTV, Bow and Warp. The market for sapphire wafers, driven by the growth in LED manufacturing, is booming. While the price has come down [...]
Adding a Digital Panel Meter to MTI Analog Output Products
Adding a Digital Panel Meter to MTI Analog Output Products Consumer Electronics Electronics Parts Profiling Thickness Description Some MTI Products with Analog outputs, Accumeasure 9000 and Microtrak 3 laser How To Use Digital Displays with Analog Outputs MTI Microtrak 3 Lasers and some of our Accumeasure amplifiers such as the Accumeasure 9000 only have analog outputs. If you wish to add a digital display, then the Lascar Panel pilot © makes a nice cost effective (~ $110) addition - Fig 1. These Digital panel meters have both 1 [...]
MTI Video: Wafer Inspection & Metrology Startup (Proforma 300iSA)
https://youtu.be/mawagL6Yg3U
MTI Video: Wafer Inspection and Metrology Tutorial (Proforma 300i)
https://www.youtube.com/watch?v=nGkbpG2sz_k Learn More Download this brochure to learn more about the Proforma 300i wafer measurement system for semiconducting and semi-insulating wafers. This article in AZO Sensors also provides information.
GaGe Whitepaper: Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications GalleryGaGe Whitepaper: Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications
Industry-Aerospace, Industry-Consumer Products, Industry-Electronics, Industry-Government/Military, Whitepapers-GaGe, z1, ZOK
GaGe Whitepaper: Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications
Wide Bandwidth Digitizer Provides Essential Data Processing in an Innovative Real-Time Channel Sounder for 5G Applications By Gerald Allgaier, GaGe ( a Vitrek Brand) Introduction Orange Labs, the research & development division of the French telecommunications multi-national, Orange, presented a paper[1] at the 13th European Conference on Antennas and Propagation (EUCAP 2019) held in Krakow, Poland. Introduced in the paper, was an innovative wideband radio channel sounder that conducts reliable, easy-to-use measurements in demanding 5G applications, such as outdoor drive tests. This article describes the GaGe EON Express 3 GS/s 12-bit PCIe Gen3 Digitizer that Orange Labs [...]