GaGe White Paper: ENOB: The Best Digitizer Performance Metric
Introduction Figure 1. GaGe High-Speed Digitizers including PC Oscilloscope Software, powerful SDKs for custom application development and turnkey integrated PC-based measurement systems. While the nominal vertical resolution of a high-speed waveform digitizer (specified in bits) is often promoted, its true performance is provided by its measured Dynamic Parameters and in particular by its Effective Number of Bits (ENOB). This article describes measurement of the Dynamic Parameters and presents measurements for a leading-edge GaGe 12-bit Digitizer. A widely used digitizer-like device, the Digital Storage Oscilloscope (DSO), is optimized for the visualization of unknown signals. The relatively [...]
Non-Contact Displacement Sensors for Detection and Measurement
Non-contact displacement sensors are designed to detect or measure physical properties such as linear displacement, thickness, proximity, and distance without physically touching the target. By emitting various forms of energy, such as capacitance, fiber optic, or laser triangulation, these sensors capture highly accurate readings without physically touching the object. This contrasts with traditional contact sensors, which rely on direct mechanical contact to gauge displacement or other physical properties. Benefits of Non-Contact vs. Contact Displacement Sensors Compared to contact sensors, non-contact displacement sensors offer faster response times, higher sampling rates, and minimal interference with the object being measured. They are [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Electronics, Industry-Manufacturing, Industry-R&D, Industry-Semiconductor, Industry-Semiconductor-MTI, Industry-Sensors, Products-MTI-Capacitance, Products-MTI-Laser/Fiber Optic, Products-MTI-Semiconductor/Metrology, Z-REPUB, z1
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]
EE White Paper: Hipot Testing of Military/Aerospace Interconnect Components
Introduction Operational performance and safety are paramount concerns when determining the acceptability of a range of interconnection products in military and aerospace applications. Connectors and relays, wires, wire bundled into cables and harnesses, all must be tested against stringent standards. The number and range of these standards is mind-numbing — and this paper makes no attempt to catalog them all. Rather, notable and salient MIL standards and similar aerospace standards will be used to site the key role that high-performance electrical safety testers, ancillary equipment and software play in effecting reliable and cost-effective compliance testing of components as [...]
How Often Should Vibration Analysis Be Performed?
How Often Should Vibration Analysis Be Performed? Once a customer takes delivery of a PBS system and learns how to use it, the next logical question is: “How often should we use it?” At a minimum, your approved maintenance program (whether it’s a program developed by your operation, or the maintenance procedures outlined by the engine/airframe manufacturer) will tell you about the intervals at which to perform a vibration analysis. Usually, there is a procedure to specify how an engine vibration analysis and balance need be only completed when squawked by a pilot or after the completion of maintenance [...]
Contact vs. Non-Contact Measurement and Linear Displacement Sensors GalleryContact vs. Non-Contact Measurement and Linear Displacement Sensors
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, Industry-Sensors, Products-MTI-Capacitance, Z-REPUB, z1, ZOK
Contact vs. Non-Contact Measurement and Linear Displacement Sensors
Contact vs. Non-Contact Measurements Choosing between a contact measurement system and a non-contact measurement system requires careful evaluation of your application’s performance needs, material properties, environmental conditions, and measurement goals. Each system type offers unique advantages- and understanding these distinctions can help you make a more informed decision. Let's explores how contact and non-contact measurement techniques work, their strengths and limitations, and where they’re best applied. What Are Contact Measurement Systems? Contact measurement systems involve tools and sensors that physically touch the object to determine various physical characteristics. These systems are widely used in dimensional metrology, offering high precision, [...]
Capacitance Sensors vs. Eddy Current Sensors Application Note
Capacitance Sensors vs. Eddy Current Sensors Application Note Capacitance sensors and Eddy current sensors are both used for non-contact measurements. Capacitive probes use electric fields to measure the distance from the sensor face to the surface of a target that is typically conductive and grounded. Eddy current probes use an alternating AC current to induce a magnetic field in a conductive target instead. In turn, the induced magnetic field produces a back magnetic field that is proportional to the gap between the probe face and the target. In a recent application note, MTI Instruments examines the differences between capacitance [...]
TESTING CHARGE AMPLIFIER GAIN AND FREQUENCY RESPONSE WITH A SIGNAL GENERATOR
[Application Note 40518] Piezoelectric transducers produce small electrical charges in response to pressure. Their sensitivity, ruggedness, and stability at high temperatures make them an essential building block of many accelerometers and pressure sensors. Applications include turbine vibration measurement (accelerometers) and combustion dynamics monitoring (pressure sensors). Typically, the high-impedance charge output produced by a piezoelectric transducer must be conditioned and amplified before transmission across system cabling to the data acquisition and measurement instrumentation. This conversion is accomplished with a device called a charge amplifier. Problem Over time, a charge amplifier’s signal response can drift. Damage to the charge amplifier or associated [...]
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges
This application note from MTI Instruments compares two technologies for measuring foam density: capacitance sensors and nuclear gauges. It examines the basic operating principles of each technology and explains why capacitance measurement is recommended for in-line measurement during foam manufacturing. Capacitance Sensors Capacitive probes are non-contact devices that use electric fields to measure foam density. In combination with a thickness value, a density measurement may be calculated. These probes consist of a capacitance sensor inside of a protective housing and are part of a larger measurement system that includes amplifiers, cables, and software. With parallel plate capacitance, the capacitance probe [...]
THICKNESS INFORMATION OF COMPOSITE MATERIALS
Composite materials consist of two or more materials which include a substrate or base material such as paper, cotton cloth, or glass cloth along with a resin or adhesive such as epoxy, melamine, or silicone. To make a thermoset laminate, the base material is coated with the adhesive so that layers of material can be pressed under heat and pressure into sheet form. The Problem: Composite material thickness needed to be verified prior to forming or machining. Due to the size of the sheets typical measurement techniques were not suitable. A consistent method to accurately measure the board thickness [...]