Engine Balancing in the Digital Age: Unlocking Faster, Smarter MRO with Integrated Aircraft Data
Introduction Modern aircraft engines generate vast amounts of operational data, yet much of this information has historically remained under utilized during maintenance procedures like vibration balancing. As fleets transition to digitally connected avionics architectures, MRO teams are rethinking how they access and apply engine data to improve efficiency and accuracy. By leveraging direct integration with onboard data networks, today’s vibration balancing systems can streamline setup, reduce dependency on external instrumentation, and deliver faster, more reliable results—ultimately helping operators minimize downtime and maintain peak engine performance. The Role of Engine Vibration Balancing MRO Jet engines operate under extreme mechanical stress, [...]
Application Note: Replace Three Legacy Systems with One: Modernizing Aerospace/Defense Test Cells with PBS eXpress
Introduction Many military/defense and commercial aerospace test cells still rely on aging analog instruments that, while functional, introduces risk through calibration challenges, legacy components, and lack of digital data access. As testing demands evolve, the industry is moving toward compact, digital platforms that simplify workflows and improve data usability. A Vitrek customer faced this challenge across multiple engine test cells. Their solution: replace two legacy systems with a single PBS eXpress R+, enabling faster setup, digital data acquisition, and automated reporting. The Challenge The customer’s test cells were built around a mix of aging instrumentation, including TrigTek tracking filters, [...]
Application Note: Accessing Digital Engine Data for Multi-Platform Aircraft Balancing with MTI PBS Systems
Introduction Modern aircraft engines are no longer dependent solely on discrete analog sensors for critical performance data. Increasingly, vibration amplitudes, phase information, and engine speed are transmitted digitally through aircraft data buses such as ARINC 429 and ARINC 664 Part 7 (AFDX). Yet in many MRO environments, balancing systems continue to rely on accelerometers and tachometer pickups—introducing additional setup time, cabling complexity, and potential variability in measurements. This disconnect between available digital data and traditional measurement approaches creates inefficiencies, particularly for facilities servicing multiple aircraft platforms. For organizations supporting a diverse fleet, the opportunity is clear: leverage the aircraft’s [...]
Portable Engine Balancing: Solving the Small Jet MRO Capacity Crunch
Introduction As the business and regional aviation sector continues its rapid growth, maintenance, repair, and overhaul (MRO) providers are struggling to keep up with demand. Portable engine-balancing technology allows maintenance teams—even less experienced staff—to perform precise vibration assessment and rapid, oneshot balancing onsite. Business Jet Fleet Growth Outpaces MRO Infrastructure The business aviation market has experienced unprecedented growth in recent years, with an increasing number of companies and private owners investing in small business jets for both personal and corporate travel. Increases in fractional ownership models and charter services are also helping drive growth. According to recent industry reports, [...]
Precision Control in Semiconductor Wafer Lapping
Application Overview Wafer lapping is a critical semiconductor thinning process that demands tight control to avoid over-removal of material, which can lead to costly yield loss. This application note details how MTI Instruments’ Accumeasure™ capacitive sensing technology enabled precise, real-time displacement and thickness measurement during lapping operations, ensuring consistent wafer quality. Challenge During lapping, wafers are thinned from the backside using a rotating abrasive surface. As the process proceeds, precise feedback is essential to monitor how much material is removed and to determine the wafer's final thickness. Traditional mechanical methods or visual inspections are not sensitive or fast enough [...]
Case-In-Point: MTI Turbine Vibration Analyzer/Balancing System Technology Principles
What do you think when you’re flying home, cruising at 30,000 feet and the drinks have just been served? Our engineers think about the ripple in the glass. That ripple signals vibration and is an indication that the engine may be in need of a balance.
MTI Instruments Whitepaper: Capacitance Guide for Industrial Applications
Capacitance Guide for Industrial Applications This guide from MTI Instruments explains what you need to know about using electrical capacitance for measurement in industrial applications, including advanced manufacturing. Basic Principles Capacitance is the ratio of the change in an electric charge to the corresponding change in its electrical potential (i.e., voltage). Capacitors, components that that have the “capacity” to store an electric charge, consist of conductive parallel plates that don’t touch or connect with each other. Instead, these metal plates are electrically-separated by air or a layer of insulating material (i.e., the dielectric). MTI’s [...]
Whitepaper: Why Capacitance? Benefits and Applications of Digital Capacitive Sensors
Industry applications illustrate the versatility and benefits of today's digital capacitive sensor technology. The electrical capacitance formed between a capacitance probe and target surface varies as a function of the distance, or gap, between those two surfaces.
Whitepaper: Semiconductor Wafer Measurement for Increased Productivity
Semiconductor Wafer Measurement for Increased Productivity This three-part article describes how manufacturers leverage capacitance-based inspection systems for semiconductor wafers. The article reviews best-practices, consequences of failing to inspect semiconductor wafers and benefits of using semi-automated, fully-automated and manual systems for wafer metrology and inspection. Part 1: Why Disc Geometry Matters in Wafer Production Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec [...]
The Cost of Failing to Inspect Semiconductor Wafers
This is the second of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Most semiconductor wafers are made of silicon, the second most common element in the Earth’s crust. Yet, silicon’s abundance does not mean that wafers are inexpensive. The pure form of silicon that’s used in semiconductors does not occur naturally and must be refined and mixed with a dopant that alters material properties and electrical characteristics. Silicon ingots are formed, wafers [...]









