Ultrasonic Medical Imaging System
Ultrasonic Medical Imaging System Customer Case A customer wants to construct an ultrasonic medical imaging system based on a transducer array. A central ultrasonic generation transducer generates a burst of ultrasonic energy which travels towards a tissue specimen. Echoes reflected off the tissue specimen are simultaneously detected by an array of 48 ultrasonic receiver transducers arranged in a dish-like pattern. The customer must simultaneously digitize all 48 signals and download them to PC RAM as quickly as possible. The customer requires 8 bit vertical resolution and would like to sample at 40 MS/s, but 20 MS/s would be acceptable. [...]
MTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit GalleryMTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit
Brand-MTI, Industry-Aerospace, Industry-Government/Military, New & Press Releases, News-MTI, News-MTI-PBS, News-Products, Press Releases-Vitrek, Products-MTI-Engine Balancing, Z-REPUB, z1
MTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit
MTI Instruments' PBS-4100+ Series Training Now Eligible for Credit Under William (Bill) O'Brien Aviation Maintenance Technician (AMT) Awards Program Lockport, IL Feb. 23, 2021 /PRNewswire/ -- MTI Instruments, Inc. (MTI Instruments), a wholly-owned subsidiary of Mechanical Technology, Incorporated (OTCQB:MKTY), today announced that its training course on the PBS-4100+ engine vibration measurement and balancing system is now credit-eligible under the Federal Aviation Administration's (FAA's) William (Bill) O'Brien Aviation Maintenance Technician (AMT) Awards Program. With the new credit designation, MTI Instrument's course, "Vibration Analysis and Engine Balancing Using the PBS-4100 System," can earn an eligible individual up to 16 hours of credit towards AMT Awards issued through the FAA [...]
Intra-Vascular Ultrasound
Intra-Vascular Ultrasound Customer Case The customer does intra-vascular diagnostic ultrasound. In this novel technique, an ultrasonic catheter is guided through a patient's blood vessel. Throughout its helical or corkscrew-like path, the ultrasonic transducer-tipped catheter emits bursts of ultrasonic energy. Reflections from the vessel wall return into the transducer and can be used to characterize such features as plaque deposits. The customer wishes to resolve features as small as 3 mm. The amount of time, D t, required for ultrasound to reflect off an interface that is a distance x away and return to the transducer is: D t = [...]
Deep Capture of Medical Sonography Signals
Deep Capture of Medical Sonography Signals Customer Case Medical sonography refers to the use of reflected ultrasonic echoes to image a patient's internal organs. A customer has a commercial medical diagnostic ultrasound system. During its operation, an external probe is placed upon the patient. An ultrasonic transducer within the probe head mechanically scans in a linear frame pattern at a rate of approximately 22 frames/sec. The transducer generates a sharp ultrasonic pulse into the patient and the same transducer detects reflected echoes from various tissue interfaces. In normal operation, the system processes the ultrasonic echoes in a prescribed fashion [...]
Wafer Backgrinding and Semiconductor Thickness Measurements GalleryWafer Backgrinding and Semiconductor Thickness Measurements
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, News-MTI-Instrumentation, News-MTI-Metrology, Products-MTI-Capacitance, Products-MTI-Semiconductor/Metrology, Z-REPUB, z1
Wafer Backgrinding and Semiconductor Thickness Measurements
Wafer Backgrinding and Thickness Measurements in Semiconductor Manufacturing Wafer backgrinding, also known as wafer thinning or wafer lapping, is a critical step in semiconductor packaging. This process, which involves grinding the backside of a semiconductor wafer, reduces its thickness to enable the stacking of integrated circuits (ICs) and support high-density packaging. The thickness of the wafer plays a crucial role in determining the overall size of the package, an important factor as modern electronics such as smartphones, laptops, and other devices continue to get thinner and more compact. In applications like MEMS (Micro-Electro-Mechanical Systems), the backgrinding process also affects [...]
Laser Scanning Microscope Interface
Laser Scanning Microscope Interface Customer Case This customer needs to interface a scanning laser microscope to their PC so that image data can be acquired and stored. Data is received from the laser microscope via an optical sensor at 1300 line scans per image. Each scan has an 8 ms duration, but 2/3 of that time is scan time and 1/3 is flyback time (dead time). The customer has determined that a 1 us sample width (or faster) would be adequate. There is also a price vs. performance issue - the customer has a tight budget and wants the [...]
Electron Paramagnetic Resonance Imaging (EPRI) Measuring of Tumor Oxygen Levels
Electron Paramagnetic Resonance Imaging (EPRI) Measuring of Tumor Oxygen Levels Customer Case The customer is improving their Electron Paramagnetic Resonance Imaging (EPRI) system that is used for the diagnosis of tumors. Using this non-invasive method, the concentration of oxygen in living tissues can be determined without the need for biopsies. Tumors that have little or no oxygen content (i.e. hypoxia) also have increased resistance to radio-frequency radiation, making it less effective as a choice for cancer treatment. Identifying those patients with hypoxic tumors allow alternative treatments to be used instead. The requirement is to capture the returned RF signals [...]
Transmission Electron Microscopy for Imaging of Biological Molecules
Transmission Electron Microscopy for Imaging of Biological Molecules Customer Case The customer is improving their customized Transmission Electron Microscope (TEM) that is optimized for imaging unstained biological molecules with minimal radiation damage. Diffraction-limited resolution of 0.25 nm is routinely obtained with a cold field-emission electron-gun operating at 40 keV. The sample is maintained at about 123 K (i.e. -150°C), both to eliminate contamination and to reduce mass-loss. The scan raster is 512 x 512 points with a dwell time of 30 microseconds per pixel (over 8.5 seconds per raster-scan). For most mass measurements, the pixels are separated by 1 [...]
Silicon Carbide vs. Silicon in EV Power Electronics GallerySilicon Carbide vs. Silicon in EV Power Electronics
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Silicon Carbide vs. Silicon in EV Power Electronics
Compare silicon carbide vs. silicon for electric vehicle (EV) power electronics and learn about SiC wafer measurement. As demand for electric vehicles (EVs) continues to grow, manufacturers are comparing two semiconductor technologies, silicon carbide and silicon, for power electronics applications. Silicon carbide (SiC) provides the high temperature resistance, low power consumption, rigidity, and support for smaller, thinner designs that EV power electronics need. Examples of SiC’s current applications include on-board DC/DC converters, off-board DC fast chargers, on-board battery chargers, EV powertrains, and automotive lighting for LEDs. According to Automotive World, SiC technology could also drive future EV innovations [...]
Treadmill Power Glitch Monitoring
Treadmill Power Glitch Monitoring Customer Case A customer develops gym equipment such as treadmills. The requirement is for an inexpensive way to monitor voltage signals for long periods of time. The treadmills are controlled by microprocessors that drive the LED displays. The customer has observed that some units intermittently fail during testing, a condition known as a "glitch" or a "brown-out". A glitch can have many causes, one of which is a weak power supply. The customer needs to capture certain key signals when a glitch occurs. At that stage, based on the captured data, it can be determined [...]