Ultrasonic Imaging
Ultrasonic Imaging Customer Case The customer is digitizing signals returned from an ultrasonic transducer used in the study of cardiac phenomena. At the moment, a 5 MHz transducer is being used, but the customer wants to upgrade to a 10 MHz transducer in the near future. This transducer will give him better spacial resolution. The customer needs one channel of very fast (100 MSPS), preferably 12-bit A/D conversion which is controlled by an external trigger signal. Bandwidth of the analog front-end of the A/D card or system must be very flat up to 15 or 20 MHz. The application [...]
Webinar Recap: Vitrek Products for Metrology and Calibration Labs
Metrology requires equipment capable of precise measurements and accurate readings. Taking the time to ensure that the instruments you use remain properly calibrated requires the right tools and training to ensure that they are in good working order. In our webinar: Vitrek Products for Metrology and Calibration Labs, we cover why you need the right calibration tools and why Vitrek offers the best high voltage tester options on the market in the form of our 4700 High Voltage Meter, PA920 Power Analyzer, and 2000MN Calibrator. […]
Ultrasound Tissue Imaging
Ultrasound Tissue Imaging Customer Case This customer is building a system to be used as a test station for examining human tissue for disease. Diseased organs differ from healthy organs in ways that can be measured via the echoes of ultrasound transmissions which are passed through the tissues. The customer's system will build a 3D image of the tissue under examination. In order to obtain a clear ultrasound image of the object being studied, the successive data captures have to be aligned to eliminate a distorted image. Jitter which would result from an asynchronous triggering is not acceptable. The [...]
Using Capacitance Sensors for Non-Conductive Material Measurement GalleryUsing Capacitance Sensors for Non-Conductive Material Measurement
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Sensors, News-MTI, News-MTI-Instrumentation, Products-MTI-Capacitance, Z-REPUB, z1
Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Ultrasonic Medical Imaging System
Ultrasonic Medical Imaging System Customer Case A customer wants to construct an ultrasonic medical imaging system based on a transducer array. A central ultrasonic generation transducer generates a burst of ultrasonic energy which travels towards a tissue specimen. Echoes reflected off the tissue specimen are simultaneously detected by an array of 48 ultrasonic receiver transducers arranged in a dish-like pattern. The customer must simultaneously digitize all 48 signals and download them to PC RAM as quickly as possible. The customer requires 8 bit vertical resolution and would like to sample at 40 MS/s, but 20 MS/s would be acceptable. [...]
Semiconductor Wafer Lapping and Displacement Measurement
Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI’s Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. Changes in electrical capacitance (displacement) were measured and then directly converted into a 24-bit digital reading to obtain precise digital thickness measurements. During lapping, a wafer of known start thickness is placed on a rotary lapping table. The backside of the wafer faces downward and toward [...]
Intra-Vascular Ultrasound
Intra-Vascular Ultrasound Customer Case The customer does intra-vascular diagnostic ultrasound. In this novel technique, an ultrasonic catheter is guided through a patient's blood vessel. Throughout its helical or corkscrew-like path, the ultrasonic transducer-tipped catheter emits bursts of ultrasonic energy. Reflections from the vessel wall return into the transducer and can be used to characterize such features as plaque deposits. The customer wishes to resolve features as small as 3 mm. The amount of time, D t, required for ultrasound to reflect off an interface that is a distance x away and return to the transducer is: D t = [...]
Why Demand for SiC Wafers is Soaring and Durable GalleryWhy Demand for SiC Wafers is Soaring and Durable
Brand-MTI, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, MTI Blog, News-MTI, News-MTI-Metrology, Products-MTI-Semiconductor/Metrology, Z-REPUB, z1
Why Demand for SiC Wafers is Soaring and Durable
Silicon carbide (SiC) wafers are in high demand, particularly in high-temperature applications. Silicon carbide (SiC), a semiconductor material made of both silicon and carbon, can withstand extreme temperatures of up to 2700°C. Often referred to as carborundum, SiC’s unique properties also make it a key material in non-electronic applications such as bulletproof vests, extrusion dies, sandpaper, and high-performance disc brakes. In the electronics industry, SiC wafers are crucial for devices operating under high temperatures, high voltages, or both. For example, they are used in electric vehicle (EV) power electronics, 5G communication systems, and LED technology, making SiC a material [...]
Deep Capture of Medical Sonography Signals
Deep Capture of Medical Sonography Signals Customer Case Medical sonography refers to the use of reflected ultrasonic echoes to image a patient's internal organs. A customer has a commercial medical diagnostic ultrasound system. During its operation, an external probe is placed upon the patient. An ultrasonic transducer within the probe head mechanically scans in a linear frame pattern at a rate of approximately 22 frames/sec. The transducer generates a sharp ultrasonic pulse into the patient and the same transducer detects reflected echoes from various tissue interfaces. In normal operation, the system processes the ultrasonic echoes in a prescribed fashion [...]
Wafer Stress Analysis Using the 300iSA
Wafer Stress Analysis Using MTI Instruments Proforma 300iSA Wafer processing involves several stages that can lead to mechanical changes in the wafer structure. These changes, or stresses, may result in deformities, making the wafer either unusable or only marginally usable. To evaluate these stresses and determine the wafer's quality, wafer stress measurement is essential. The Proforma 300iSA wafer characterization tool offers a powerful solution for wafer stress analysis. It allows for the analysis of a wafer both before and after processing. By comparing these two states, the Proforma 300iSA effectively evaluates the wafer's stress levels and mechanical alterations, providing [...]