Thickness Measurement of Dielectric Materials
Thickness Measurement of Dielectric Materials Manufacturing EV Battery Production Thickness, Distance --- Description --- Introduction Many applications, both in manufacturing and research, require precise material thickness measurements. This becomes especially difficult if the material is moving, is non conductive and/or translucent to clear. The specifics of your application may make accurate measurements difficult; many circumstances prohibit contact measurement, and make laser measurements difficult or impossible, for example with thin clear materials such as glass, sapphire, plastic . In cases such as these, capacitance measurement provides a highly accurate and cost-effective solution. [...]
Radar Rackmount System for Large Record Lengths
Radar Rackmount System for Large Record Lengths Customer Case The customer needs to acquire data from his radar system at a sampling rate of 1.5 MSPS for two channels (I & Q). At the moment, this data must be acquired for at least 10 seconds, but the record length may increase by almost 100 times in the future. This equipment needs to be installed in a rackmounted environment, so the host computer must have rackmount capability. An integrated monitor is also important as it eliminates the need to purchase a rack-mounted monitor. Keyboard and mouse must also be rackmountable. [...]
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges Foam Density Measurement Manufacturing EV Battery Production Thickness, Distance This application note from MTI Instruments compares two technologies for measuring foam density: capacitance sensors and nuclear gauges. It examines the basic operating principles of each technology and explains why capacitance measurement is recommended for in-line measurement during foam manufacturing. Capacitance Sensors Capacitive probes are non-contact devices that use electric fields to measure foam density. In combination with a thickness value, a density measurement may be calculated. These probes consist of a capacitance [...]
Interfacing to Offset IF Radar Altimeter
Interfacing to Offset IF Radar Altimeter Customer Case The customer is using an offset IF radar to map forest terrain density. The equipment will be mounted in an aircraft, which will also be carrying a Global Positioning System (GPS) for reference. The plane will fly at an altitude of 10,000 feet. A 512 ns radar pulse will be sent out and a return pulse will be received about 20 uS later, from which 10,000 samples will be acquired. After the pulse is received, there will be a relatively long re-arm time of about 250 to 300 uS for the [...]
Trigger Out Modification for CP500 Class Boards
Trigger Out Modification for CP500 Class Boards Customer Case Many A/D applications including Ultrasonics, Radar, Lidar, Hard Disk testing and CCD capture require maximal synchronicity between a trigger and the sampling clock. GaGe Case Solution GaGe now offers the TRIGGER OUT option as a means of synchronizing systems to the sampling clock on GaGe's CP500-class of A/D and scope cards, including CS8500, CS12100 and CS1250. The need for synchronicity can be understood by considering a typical ultrasonic pulse-echo system. An ultrasonic pulser-receiver generates ultrasonic pulses from a transducer which, microseconds later, receives echo signals reflected from a test specimen. [...]
Connecting Encoders to MTI’s Digital Accumeasure
Connecting Encoders to MTI's Digital Accumeasure MTI's Digital Accumeasure D has the ability to accept one or two digital quadrature encoders. The encoders can be linear slide-type or rotary. Digital encoders allow for tracking the position of capacitive probes such that you can synchronize a probe's position with the probe's displacement data. Two common examples are: Rotary shaft runout: shaft (radial) displacement vs. angular encoder position X/Y position of probes measuring wafer thickness (map wafer thickness) Accumeasure software (basic and measurement) allows the display of instantaneous encoder counts as well as probe displacement data; however, [...]
Testing for Connector Failure Due to Vibration or Shock
Testing for Connector Failure Due to Vibration or Shock Mobile Communications Equipment Needs Reliable Connectors That Will Not Disconnect with Shock or Vibration Introduction A large multinational company approached MTI to provide a sensor capable of measuring displacement that also wouldn’t load the target (connector). Shock and vibration testing would span 2-15G and the target connectors were very small. Application MTI’s 2100 optical displacement sensor system is ideal for this kind of application because very small probes can be used and they measure displacement via reflected light. Of course, reflected light does [...]
Wafer Characterization
Semiconductor Wafer Characterization Surface Overview Wafer characterization is a critical part of quality control and process optimization in the semiconductor and solar industries. Accurate characterization ensures wafers meet mechanical and dimensional standards such as thickness, bow, and warp — all essential to downstream device performance and yield. Description Thickness Measurement ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness [...]
Monitoring Critical Variables
Monitoring Critical Variables Customer Case The customer wanted a quick visual inspection of many readings of slow varying parameters. Readings of pressure, temperature and voltages had to be compared with reference values and the differences had to be displayed in analog fashion in the form of a simple visual display. A Go/No Go decision had to be reached almost instantly. GaGe Case Solution The solution suggested by a major electronics company was to multiplex the differences 32 readings a channel for two channels, this gives a total of 72 reading in one display. The zero line is the no [...]
In-Situ Particle Detection
In-Situ Particle Detection Research & Development In-Situ Particle Detection Presence/Absence Description Introduction:  Foreign particles in food stuffs, plant produce, grains, etc. can lead to customer dissatisfaction when the items are packaged for sale. In some cases — it can be dangerous. Opportunity:  A major cigarette producer contacted MTI Instruments requesting a system to detect extraneous material, metal, plastic, filter fiber, and other contaminants. Background:  A cigarette’s dielectric footprint is controlled by the tobacco packing density, moisture content and the type of tobacco leaf. - packing density is controlled by the [...]