Non-Destructive Testing (NDT) for Steel Manufacturing
Non-Destructive Testing (NDT) for Steel Manufacturing Customer Case The customer is a custom-built contractor of Non-Destructive Test (NDT) instruments for steel manufacturing. NDT uses ultrasonic pulses to scan through thick sheets of metals for possible causes of early wear, such as cracks or impurities. The stimulus is a stream of ultrasonic pulses. The response is their reflection from various depths. The center frequencies used by this customer are in the range of 250 KHz to 2.25 MHz and pulses are about 10 microseconds. The pulse repeat frequency (PRF) is less than 1 KHz. The thickness of steel sheets is [...]
Galvannealing Phosphor Thermometry
Galvannealing Phosphor Thermometry Customer Case During the process of galvanizing, steel is dipped in a bath of liquid tin to increase its resistance to oxidation and moisture. After galvanizing, a precise heat treatment allows control of the mechanical properties of the final galvanized steel. This heat treatment is known as galvannealing. During galvannealing, precise temperature control is necessary to promote the desired grain growth in the steel's tin-rich coating. Galvanneal thermometry is difficult. The rolling of the hot steel makes contact thermocouples and optical pyrometry impractical. A customer's galvanneal furnace is equipped for phosphor thermometry. This novel technique uses [...]
Thickness Measurement of Dielectric Materials
Thickness Measurement of Dielectric Materials Manufacturing EV Battery Production Thickness, Distance --- Description --- Introduction Many applications, both in manufacturing and research, require precise material thickness measurements. This becomes especially difficult if the material is moving, is non conductive and/or translucent to clear. The specifics of your application may make accurate measurements difficult; many circumstances prohibit contact measurement, and make laser measurements difficult or impossible, for example with thin clear materials such as glass, sapphire, plastic . In cases such as these, capacitance measurement provides a highly accurate and cost-effective solution. [...]
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges Foam Density Measurement Manufacturing EV Battery Production Thickness, Distance This application note from MTI Instruments compares two technologies for measuring foam density: capacitance sensors and nuclear gauges. It examines the basic operating principles of each technology and explains why capacitance measurement is recommended for in-line measurement during foam manufacturing. Capacitance Sensors Capacitive probes are non-contact devices that use electric fields to measure foam density. In combination with a thickness value, a density measurement may be calculated. These probes consist of a capacitance [...]
Pulsed Electric Field Food Processing
Pulsed Electric Field Food Processing Customer Case Pulsed Electric Field Food Processing is a continuous food processing system in which beverages (with a known conductivity) are pumped through a chamber containing an electrode. Pulses of high voltage electricity are passed across the electrode, thus through the liquid as well. It is a pasteurization technique being studied at Ohio State University. The need is to be able to monitor, display, and record to hard drive storage, voltage and current waveforms. They need to be able to draw information about the pulse duration, peak voltage, etc. from the recorded waveforms. Waveforms [...]
Connecting Encoders to MTI’s Digital Accumeasure
Connecting Encoders to MTI's Digital Accumeasure MTI's Digital Accumeasure D has the ability to accept one or two digital quadrature encoders. The encoders can be linear slide-type or rotary. Digital encoders allow for tracking the position of capacitive probes such that you can synchronize a probe's position with the probe's displacement data. Two common examples are: Rotary shaft runout: shaft (radial) displacement vs. angular encoder position X/Y position of probes measuring wafer thickness (map wafer thickness) Accumeasure software (basic and measurement) allows the display of instantaneous encoder counts as well as probe displacement data; however, [...]
Testing for Connector Failure Due to Vibration or Shock
Testing for Connector Failure Due to Vibration or Shock Mobile Communications Equipment Needs Reliable Connectors That Will Not Disconnect with Shock or Vibration Introduction A large multinational company approached MTI to provide a sensor capable of measuring displacement that also wouldn’t load the target (connector). Shock and vibration testing would span 2-15G and the target connectors were very small. Application MTI’s 2100 optical displacement sensor system is ideal for this kind of application because very small probes can be used and they measure displacement via reflected light. Of course, reflected light does [...]
Phase Conjugate Sonar
Phase Conjugate Sonar Customer Case Dissipationless physical systems, such as simple planetary motion or a swinging pendulum, exhibit time-reversal invariance. This means that if time were reversed the way a film projector can be, then the resulting motion would be allowed by the equations governing the system. It follows that if all velocities in a dissipationless system are suddenly reversed, the system will follow a time-reversed trajectory. Dissipationless or adiabatic wave propagation is time-reversal invariant. Phase Conjugate Optics involves the deliberate reversal of complex light paths. A customer is doing Phase Conjugate Sonar using sound instead of light. The [...]
Wafer Characterization
Semiconductor Wafer Characterization Surface Overview Wafer characterization is a critical part of quality control and process optimization in the semiconductor and solar industries. Accurate characterization ensures wafers meet mechanical and dimensional standards such as thickness, bow, and warp — all essential to downstream device performance and yield. Description Thickness Measurement ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness [...]
In-Situ Particle Detection
In-Situ Particle Detection Research & Development In-Situ Particle Detection Presence/Absence Description Introduction:  Foreign particles in food stuffs, plant produce, grains, etc. can lead to customer dissatisfaction when the items are packaged for sale. In some cases — it can be dangerous. Opportunity:  A major cigarette producer contacted MTI Instruments requesting a system to detect extraneous material, metal, plastic, filter fiber, and other contaminants. Background:  A cigarette’s dielectric footprint is controlled by the tobacco packing density, moisture content and the type of tobacco leaf. - packing density is controlled by the [...]