How Capacitive Measurement Can Help Reduce Packaging Waste
Product packaging is often made of lightweight polymeric foams or plastic sheets and films. These materials are relatively inexpensive, but manufacturers still want to minimize waste and maximize yields. Across high volumes of low-cost materials, even a small per-unit savings can become significant, especially as the price of petroleum – a key ingredient in many polymers – continues to rise. For companies with environmental sustainability efforts, there are other important considerations as well. The excessive use of packaging materials can contribute to environmental pollution, especially with polymers that are slow to degrade. Yet, materials such as plastic sheets and [...]
Non-Contact Displacement Sensors for Detection and Measurement
Non-contact displacement sensors are designed to detect or measure physical properties such as linear displacement, thickness, proximity, and distance without physically touching the target. By emitting various forms of energy, such as capacitance, fiber optic, or laser triangulation, these sensors capture highly accurate readings without physically touching the object. This contrasts with traditional contact sensors, which rely on direct mechanical contact to gauge displacement or other physical properties. Benefits of Non-Contact vs. Contact Displacement Sensors Compared to contact sensors, non-contact displacement sensors offer faster response times, higher sampling rates, and minimal interference with the object being measured. They are [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Electronics, Industry-Manufacturing, Industry-R&D, Industry-Semiconductor, Industry-Semiconductor-MTI, Industry-Sensors, Products-MTI-Capacitance, Products-MTI-Laser/Fiber Optic, Products-MTI-Semiconductor/Metrology, Z-REPUB, z1
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]
How Often Should Vibration Analysis Be Performed?
How Often Should Vibration Analysis Be Performed? Once a customer takes delivery of a PBS system and learns how to use it, the next logical question is: “How often should we use it?” At a minimum, your approved maintenance program (whether it’s a program developed by your operation, or the maintenance procedures outlined by the engine/airframe manufacturer) will tell you about the intervals at which to perform a vibration analysis. Usually, there is a procedure to specify how an engine vibration analysis and balance need be only completed when squawked by a pilot or after the completion of maintenance [...]
Contact vs. Non-Contact Measurement and Linear Displacement Sensors GalleryContact vs. Non-Contact Measurement and Linear Displacement Sensors
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, Industry-Sensors, Products-MTI-Capacitance, Z-REPUB, z1, ZOK
Contact vs. Non-Contact Measurement and Linear Displacement Sensors
Contact vs. Non-Contact Measurements Choosing between a contact measurement system and a non-contact measurement system requires careful evaluation of your application’s performance needs, material properties, environmental conditions, and measurement goals. Each system type offers unique advantages- and understanding these distinctions can help you make a more informed decision. Let's explores how contact and non-contact measurement techniques work, their strengths and limitations, and where they’re best applied. What Are Contact Measurement Systems? Contact measurement systems involve tools and sensors that physically touch the object to determine various physical characteristics. These systems are widely used in dimensional metrology, offering high precision, [...]
Capacitance Sensors vs. Eddy Current Sensors Application Note
Capacitance Sensors vs. Eddy Current Sensors Application Note Capacitance sensors and Eddy current sensors are both used for non-contact measurements. Capacitive probes use electric fields to measure the distance from the sensor face to the surface of a target that is typically conductive and grounded. Eddy current probes use an alternating AC current to induce a magnetic field in a conductive target instead. In turn, the induced magnetic field produces a back magnetic field that is proportional to the gap between the probe face and the target. In a recent application note, MTI Instruments examines the differences between capacitance [...]
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges
This application note from MTI Instruments compares two technologies for measuring foam density: capacitance sensors and nuclear gauges. It examines the basic operating principles of each technology and explains why capacitance measurement is recommended for in-line measurement during foam manufacturing. Capacitance Sensors Capacitive probes are non-contact devices that use electric fields to measure foam density. In combination with a thickness value, a density measurement may be calculated. These probes consist of a capacitance sensor inside of a protective housing and are part of a larger measurement system that includes amplifiers, cables, and software. With parallel plate capacitance, the capacitance probe [...]
Capacitance Sensing vs. Strain Gauge Sensing Application Note
Capacitance Sensing vs. Strain Gauge Sensing Application Note Capacitance probes that are embedded in piezo flexure stages can provide significantly greater accuracy than strain gauges. Although some minor mounting modifications are required, capacitance probes with picoscale positioning provide higher linearity, greater long-term stability, and better direct measurement. Capacitance sensors cost more, however, and are limited by sensing distance. Therefore, strain gauge sensors remain a good choice for applications where cost is a consideration, sensing distances are larger, and high resolution or high accuracy are required. In a recent application note, MTI Instruments examines the differences between capacitance probes and [...]
Using Capacitance Sensors for Non-Conductive Material Measurement GalleryUsing Capacitance Sensors for Non-Conductive Material Measurement
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Sensors, News-MTI, News-MTI-Instrumentation, Products-MTI-Capacitance, Z-REPUB, z1
Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Semiconductor Wafer Lapping and Displacement Measurement
Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI’s Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. Changes in electrical capacitance (displacement) were measured and then directly converted into a 24-bit digital reading to obtain precise digital thickness measurements. During lapping, a wafer of known start thickness is placed on a rotary lapping table. The backside of the wafer faces downward and toward [...]