GRINDING PROCESS
A cylindrical grinding process finishes most wheel spindle surfaces. It is essential that this grinding process leave a surface finish that is smooth and free of defects with minimal runout. No grinder produces a perfect surface. Grinder wheel runout, improperly dressed wheels and fixture vibrations can cause chatter on the spindle surface finish. Chatter is a series of microscopic, repetitive imperfections, or waves, in the surface of the material being machined. The required production environment sensor must have small spatial resolution, high frequency response and large standoff distance for easy loading and unloading of parts. Additionally, the measurement accuracy had to be [...]
Brake Rotors Thickness Variation
Industry Automotive Applications Brake Rotors Thickness Variation Measurement Type Surface Description Driving cross country or cross town, we give little thought to the operation or complexity of our vehicle braking systems. They only cross our mind when we absolutely need them; we never stop to think about the extensive design and testing that makes them such a lifesaver. Take the brake rotor for example. Under normal operating conditions it’s subjected to extreme temperatures and forces, which can cause rotor distortion and potential failure. To make certain it can withstand [...]
Oil Film Thickness Measurement
Industry Automotive Applications Oil Film Measurement Type Level Description A top marine engine manufacturer commissioned MTI Instruments to design and manufacture a non-contact sensor to measure the microscopic oil film layer between the engine cylinder wall and the piston ring. Engine testing is normally performed through a range of low RPM’s to high RPM’s (400- 6000) with piston linear speeds approaching 500 inches/second and at various torques. A measuring system with high frequency response and small sensor size was essential to keep engine machining to a minimum while not altering [...]
Compliance Testing of Harmonic Current Emissions According to IEC61000-3-2 and IEC61000-3-12.
Compliance Testing of Harmonic Current Emissions According to IEC61000-3-2 and IEC61000-3-12. Using the Vitrek PA900 Precision Harmonic Power Analyzer Introduction Compliance with electromagnetic compatibility (EMC) standards is mandatory for electrical and electronic equipment sold in many global markets. Among these, the IEC61000-3-2 and IEC61000-3-12 standards specify limits for harmonic current emissions of equipment connected to low-voltage public supply systems. These limits ensure that individual devices do not contribute excessively to harmonic distortion on the power grid, which can lead to overheating in transformers, nuisance tripping of breakers, and interference with other equipment. The Vitrek PA900 Precision Power [...]
Brake Rotors
Industry Automotive Applications Brake Rotors Measurement Type Surface Description Under normal operating conditions brake rotors are subjected to extreme temperatures and forces, which can cause rotor distortion and potential failure. To make certain it can withstand these conditions; extensive laboratory testing is performed to optimize design for longevity, short stopping distance, and vibration free operation. Extensive on-vehicle testing is done under real life conditions to test prototype units and engineering designs. Test vehicles are driven for long periods of time while brake performance is monitored by a variety of sensors [...]
Power Analyzers: The Backbone of Modern Electrical Engineering
Introduction In the fast-paced world of electrical engineering, ensuring accurate power measurement is crucial for efficiency, reliability, and compliance. Power analyzers play a key role in industries ranging from renewable energy to semiconductor manufacturing, providing engineers with the insights needed to optimize performance and troubleshoot electrical systems. At the forefront of this technology is Vitrek, a leading provider of high-accuracy power analyzers designed for demanding applications. The Role of Power Analyzers in Engineering Power analyzers measure critical electrical parameters such as voltage, current, power factor, and harmonic distortion. Unlike basic meters, these advanced instruments offer high precision measurements over [...]
GLASS THICKNESS
Industry Consumer Electronics Applications Glass Thickness Measurement Type Thickness Description Did you know that glass thickness can be measured with a capacitance probe? You will need some equipment: Digital Accumeasure D200 ASP-2500-CTA Dielectric probe (The capacitance probe has a sensing area of 11.25 mm) Range extension = 3X, 10Hz filter Introduction: An industrial glass fabricator needed a way to determine the thickness of glass, before cutting it to shape and coating it. The glass sample was marked with indices to find the measuring points. The sample center point -5- thickness was checked [...]
Metrology Engineer Standardizes on Vitrek 4700 for HV Measurement Accuracy & Traceability
Metrology Engineer Standardizes on Vitrek 4700 for HV Measurement Accuracy & Traceability Legacy HV Test Tools Less Accurate and More Cumbersome About Customer: Ken Sams, Metrology & QC Engineer Ken works for a leading global electrical insulation test equipment provider serving a wide range of industries including high power cable applications. The company provides critical electrical insulation measurement products, from insulation testers to dielectric breakdown testers. Ken’s responsibility includes both internal quality and field service. Challenge Achieve high voltage measurement during production testing and calibration procedures, including specialized testing. In these challenging testing environments, even the smallest [...]
HEIGHT GAP OF INKJET PRINTERS
Industry Consumer Electronics Applications Height Gap Of Inkjet Printers Measurement Type Positioning Description Introduction: Inkjet printers require a certain distance between the inkjet print head and the paper. If the distance is set incorrectly, the printed images get blurry. Current state of the art printers have the print head nozzles built right into the bottom of the ink reservoir (B) as shown below. When the ink cartridge is installed in the printer, the inkjet nozzles (made out of silicon) essentially become a grounded target through the connections shown at [...]
Precision Control in Semiconductor Wafer Lapping
Application Overview Wafer lapping is a critical semiconductor thinning process that demands tight control to avoid over-removal of material, which can lead to costly yield loss. This application note details how MTI Instruments’ Accumeasure™ capacitive sensing technology enabled precise, real-time displacement and thickness measurement during lapping operations, ensuring consistent wafer quality. Challenge During lapping, wafers are thinned from the backside using a rotating abrasive surface. As the process proceeds, precise feedback is essential to monitor how much material is removed and to determine the wafer's final thickness. Traditional mechanical methods or visual inspections are not sensitive or fast enough [...]








