How Often Should Vibration Analysis Be Performed?
How Often Should Vibration Analysis Be Performed? Once a customer takes delivery of a PBS system and learns how to use it, the next logical question is: “How often should we use it?” At a minimum, your approved maintenance program (whether it’s a program developed by your operation, or the maintenance procedures outlined by the engine/airframe manufacturer) will tell you about the intervals at which to perform a vibration analysis. Usually, there is a procedure to specify how an engine vibration analysis and balance need be only completed when squawked by a pilot or after the completion of maintenance [...]
Contact vs. Non-Contact Measurement and Linear Displacement Sensors GalleryContact vs. Non-Contact Measurement and Linear Displacement Sensors
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, Industry-Sensors, Products-MTI-Capacitance, Z-REPUB, z1, ZOK
Contact vs. Non-Contact Measurement and Linear Displacement Sensors
Contact vs. Non-Contact Measurements Choosing between a contact measurement system and a non-contact measurement system requires careful evaluation of your application’s performance needs, material properties, environmental conditions, and measurement goals. Each system type offers unique advantages- and understanding these distinctions can help you make a more informed decision. Let's explores how contact and non-contact measurement techniques work, their strengths and limitations, and where they’re best applied. What Are Contact Measurement Systems? Contact measurement systems involve tools and sensors that physically touch the object to determine various physical characteristics. These systems are widely used in dimensional metrology, offering high precision, [...]
Capacitance Sensors vs. Eddy Current Sensors Application Note
Capacitance Sensors vs. Eddy Current Sensors Application Note Capacitance sensors and Eddy current sensors are both used for non-contact measurements. Capacitive probes use electric fields to measure the distance from the sensor face to the surface of a target that is typically conductive and grounded. Eddy current probes use an alternating AC current to induce a magnetic field in a conductive target instead. In turn, the induced magnetic field produces a back magnetic field that is proportional to the gap between the probe face and the target. In a recent application note, MTI Instruments examines the differences between capacitance [...]
Automotive Engine Controller Monitoring
Automotive Engine Controller Monitoring Customer Case The customer is a major electronics manufacturer who wants to find a cost effective replacement to VXI digitizers in testing automotive engine control signals. The requirement is for several ATE stations. Each one will require 4 single-ended channels or 2 "true differential" channels, 4 MHz of input analog bandwidth (mostly single shot) with voltage ranges from 0.05 to 70 volts. The digitizers must have at least 12 bits of vertical resolution, 0.5% accuracy and ½ MegaSample per channel of acquisition memory. The customer would like to operate the station under a controlling LabVIEW [...]
Fiber Optic Automated Measurement System
Fiber Optic Automated Measurement System Customer Case The customer is in the business of developing lasers and LED components for fiber optic data \ telecommunications applications. The requirement is for an automated test system to monitor the pulse characteristics of the laser. The customer will require 3 channels at high vertical resolution due to the fact that some variances in amplitude will be only 1 mV and need to be detected. The goal is to capture 10,000 samples per channel at 50 MegaSamples per second with a 1 KHz to 5 KHz Pulse Repeat Frequency (PRF). The customer would [...]
White Paper: Hipot Testing of Military/Aerospace Interconnect Components
Introduction Operational performance and safety are paramount concerns when determining the acceptability of a range of interconnection products in military and aerospace applications. Connectors and relays, wires, wire bundled into cables and harnesses, all must be tested against stringent standards. The number and range of these standards is mind-numbing — and this paper makes no attempt to catalog them all. Rather, notable and salient MIL standards and similar aerospace standards will be used to site the key role that high-performance electrical safety testers, ancillary equipment and software play in effecting reliable and cost-effective compliance testing of components as [...]
Using Capacitance Sensors for Non-Conductive Material Measurement GalleryUsing Capacitance Sensors for Non-Conductive Material Measurement
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Sensors, News-MTI, News-MTI-Instrumentation, Products-MTI-Capacitance, Z-REPUB, z1
Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Semiconductor Wafer Lapping and Displacement Measurement
Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI’s Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. Changes in electrical capacitance (displacement) were measured and then directly converted into a 24-bit digital reading to obtain precise digital thickness measurements. During lapping, a wafer of known start thickness is placed on a rotary lapping table. The backside of the wafer faces downward and toward [...]
Google Scholar
Visit and View "GaGe Digitizer" on Google Scholar Visit and View "GaGe Applied Technologies" on Google Scholar Google Scholar is a dedicated search site for scholarly literature that includes academic research papers, technical articles, patents, and more. Use the above links to review results of all articles in which GaGe products and services have been cited for various applications in fields such as: Wideband Signal Analysis RADAR Design and Test Signals Intelligence (SIGINT) Ultrasonic Non-Destructive Testing (NDT) LIDAR Systems Communications Optical Coherence Tomography (OCT) Mass Spectroscopy Ultrasound Imaging Time of Flight (TOF) Life Sciences [...]
Wafer Stress Analysis Using the 300iSA
Wafer Stress Analysis Using MTI Instruments Proforma 300iSA Wafer processing involves several stages that can lead to mechanical changes in the wafer structure. These changes, or stresses, may result in deformities, making the wafer either unusable or only marginally usable. To evaluate these stresses and determine the wafer's quality, wafer stress measurement is essential. The Proforma 300iSA wafer characterization tool offers a powerful solution for wafer stress analysis. It allows for the analysis of a wafer both before and after processing. By comparing these two states, the Proforma 300iSA effectively evaluates the wafer's stress levels and mechanical alterations, providing [...]