Robotic Weld Inspection
Automotive Robotic Weld Inspection Presence/Absence Description
Sheet Metal Monitoring
Sheet Metal Monitoring Automotive Sheet Metal Monitoring Thickness Description Introduction: When sheet metal is formed in a continuous process it needs monitoring during the actual feed prior to machining or forming to prevent defects and scrap.  One way to accomplish this is to use a laser sensor to measure the thickness. Problem: A major electrical equipment manufacturer needed a way to monitor the incoming material just prior to shearing and forming. The device needed to be robust, non-contact, reliable, accurate, and fast. The client would be using their data acquisition [...]
Wire Bonding
Wire Bonding Semiconductor Wire Bonding Level Description Introduction What is Wire Bonding? Wire bonding is a critical semiconductor manufacturing process that creates electrical connections between integrated circuits (ICs) and their packaging substrates. This wire bonding technique uses ultra-thin bond wires, typically made of gold or aluminum, to establish reliable electrical pathways in microelectronics applications. Understanding Wire Bond Fundamentals A typical wire bond consists of bonded wire connecting a die pad to a substrate pad on a PC board. The bond wire diameter varies between 18 and 50 microns, with 25 microns [...]
GaAs Substrate Thickness Measurement
Semiconductor Gaas Substrate Thickness Measurement Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction:  Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI's Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor's measuring field. Fortunately, MTI has a solution to this problem. Solution:  It’s possible to measure the thickness and TTV of high resistivity semiconducting wafers (like GaAs) using non-contact [...]
Photolithography Using Capacitance Sensors
Photolithography Using Capacitance Sensors Semiconductor Photolithography Using Capacitance Sensors Positioning Description When it comes to photolithography, how accurate are our sensors? Accurate enough to measure this: ​   Photo by D. Carr and H. Craighead, Cornell The world's smallest guitar is 10 micrometers long -- about the size of a single cell -- with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]
MTI Video: Wafer Inspection & Metrology Startup (Proforma 300iSA)
https://youtu.be/mawagL6Yg3U
MTI Video: Wafer Inspection and Metrology Tutorial (Proforma 300i)
https://www.youtube.com/watch?v=nGkbpG2sz_k Learn More Download this brochure to learn more about the Proforma 300i wafer measurement system for semiconducting and semi-insulating wafers. This article in AZO Sensors also provides information.
New Video from MTI! Closed-loop System to Monitor and Control Conductive Film Thickness During Manufacturing
Closed-loop System to Monitor and Control Conductive Film Thickness During Manufacturing This animation demonstrates how Accumeasure with capacitance probes can be used as a solution to measure and control conductive film thickness in a production line where these measurements can be fed back to a controller which adjusts the roller(s) to increase or decrease the gap to keep the film’s thickness within specification. The MTI Instruments Capacitive system has greater than 100 nm resolution and 1um accuracy. This solution is appropriate for measuring the following: EV battery plate thickness Non-woven conductive material thickness Conductive film thickness Roll-to-roll conductive [...]
WAFER MEASUREMENT – UNGROUNDED
Industry Semiconductor Applications Wafer Measurement – Ungrounded Measurement Type Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
PHOTOLITHOGRAPHY USING CAPACITANCE SENSORS
Industry Semiconductor Applications Lithography Optics Position Focus Measurement Type Positioning Description When it comes to photolithography, how accurate are our sensors? Photo by D. Carr and H. Craighead, Cornell - The world’s smallest guitar is 10 micrometers long — about the size of a single cell — with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]