WAFER MEASUREMENT – UNGROUNDED
Industry Semiconductor Applications Wafer Measurement – Ungrounded Measurement Type Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
PHOTOLITHOGRAPHY USING CAPACITANCE SENSORS
Industry Semiconductor Applications Lithography Optics Position Focus Measurement Type Positioning Description When it comes to photolithography, how accurate are our sensors? Photo by D. Carr and H. Craighead, Cornell - The world’s smallest guitar is 10 micrometers long — about the size of a single cell — with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]
Creating a Compensation File for a Recipe for the Proforma 300iSA – Video GalleryCreating a Compensation File for a Recipe for the Proforma 300iSA – Video
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The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology GalleryThe Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
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The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
This is the third of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The second article examines the cost of failing to inspect semiconductor wafers. Fully automated systems that can load, scan, and unload wafers are fast, convenient, and efficient at high volumes. They’re useful for checking every wafer in every batch, but these systems are expensive. Semi-automated and manual systems cost significantly less and are generally used for lower volumes; however, they’re also easy-to-use and can make fast, accurate measurements that support production flow. Semi-automated and [...]
Why Disc Geometry Matters In Wafer Production GalleryWhy Disc Geometry Matters In Wafer Production
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Why Disc Geometry Matters In Wafer Production
This is the first of three articles in Semiconductor Wafer Measurement for Increased Profitability. The second article examines the cost of failing to inspect semiconductor wafers. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec after cutting, it may be possible to reprocess the wafer. Cutting is only the first [...]
Measuring Glass wafer thickness with a Proforma 300i
Measuring glass substrate thickness with a Proforma 300i Semiconductor Glass Wafer Thickness Measurement Thickness Applications testing of glass (substrate) thickness An applications experiment was made with the MTI Proforma 300i Semiconductor thickness system to determine if it’s useful to measure glass substrate thicknesses typically found as support structures for Si semiconductors that are used for fabricating MEMs components and other thin Si wafers. The MEMs Silicon wafer is so thin after grinding that it needs the support of a thicker substrate to prevent breakage of the wafer during the back grinding/thinning [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
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Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]