Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges
This application note from MTI Instruments compares two technologies for measuring foam density: capacitance sensors and nuclear gauges. It examines the basic operating principles of each technology and explains why capacitance measurement is recommended for in-line measurement during foam manufacturing. Capacitance Sensors Capacitive probes are non-contact devices that use electric fields to measure foam density. In combination with a thickness value, a density measurement may be calculated. These probes consist of a capacitance sensor inside of a protective housing and are part of a larger measurement system that includes amplifiers, cables, and software. With parallel plate capacitance, the capacitance probe [...]
THICKNESS INFORMATION OF COMPOSITE MATERIALS
Composite materials consist of two or more materials which include a substrate or base material such as paper, cotton cloth, or glass cloth along with a resin or adhesive such as epoxy, melamine, or silicone. To make a thermoset laminate, the base material is coated with the adhesive so that layers of material can be pressed under heat and pressure into sheet form. The Problem: Composite material thickness needed to be verified prior to forming or machining. Due to the size of the sheets typical measurement techniques were not suitable. A consistent method to accurately measure the board thickness [...]
Get More Out Of Your Military & Aerospace Applications
When testing the electrical systems for your military and aerospace applications, you need to ensure they are ready for the job and meet all the necessary standards. These specialized systems work to keep the highly sophisticated and advanced technology housed in these applications running at full strength, which requires the right amount of power to do their jobs effectively. Having the right electrical safety and performance testing equipment on hand can help determine the overall effectiveness of your applications. […]
White Paper: Hipot Testing of Military/Aerospace Interconnect Components
Introduction Operational performance and safety are paramount concerns when determining the acceptability of a range of interconnection products in military and aerospace applications. Connectors and relays, wires, wire bundled into cables and harnesses, all must be tested against stringent standards. The number and range of these standards is mind-numbing — and this paper makes no attempt to catalog them all. Rather, notable and salient MIL standards and similar aerospace standards will be used to site the key role that high-performance electrical safety testers, ancillary equipment and software play in effecting reliable and cost-effective compliance testing of components as [...]
Webinar Recap: Vitrek Products for Metrology and Calibration Labs
Metrology requires equipment capable of precise measurements and accurate readings. Taking the time to ensure that the instruments you use remain properly calibrated requires the right tools and training to ensure that they are in good working order. In our webinar: Vitrek Products for Metrology and Calibration Labs, we cover why you need the right calibration tools and why Vitrek offers the best high voltage tester options on the market in the form of our 4700 High Voltage Meter, PA920 Power Analyzer, and 2000MN Calibrator. […]
Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Semiconductor Wafer Lapping and Displacement Measurement
Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI’s Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. Changes in electrical capacitance (displacement) were measured and then directly converted into a 24-bit digital reading to obtain precise digital thickness measurements. During lapping, a wafer of known start thickness is placed on a rotary lapping table. The backside of the wafer faces downward and toward [...]
Torque Converter
Industry Automotive Applications Torque Converter Measurement Type Surface Description Since minute defects in the torque converter casing wall thickness can result in unacceptable and dangerous torque converter expansion, a precision measurement system was needed to measure the impeller hub displacement and thus the torque converter axial displacement. An AC dynamometer would be required to spin the torque converter at a high rate of speed while a fast response hydraulic system is needed to pressurize the converter to pressures up to 150 psi. MTI’s MicroTrak laser sensor was selected because it offered [...]
Why Demand for SiC Wafers is Soaring and Durable
Silicon carbide (SiC) wafers are in high demand, particularly in high-temperature applications. Silicon carbide (SiC), a semiconductor material made of both silicon and carbon, can withstand extreme temperatures of up to 2700°C. Often referred to as carborundum, SiC’s unique properties also make it a key material in non-electronic applications such as bulletproof vests, extrusion dies, sandpaper, and high-performance disc brakes. In the electronics industry, SiC wafers are crucial for devices operating under high temperatures, high voltages, or both. For example, they are used in electric vehicle (EV) power electronics, 5G communication systems, and LED technology, making SiC a material [...]
Wafer Stress Analysis Using the 300iSA
Wafer Stress Analysis Using MTI Instruments Proforma 300iSA Wafer processing involves several stages that can lead to mechanical changes in the wafer structure. These changes, or stresses, may result in deformities, making the wafer either unusable or only marginally usable. To evaluate these stresses and determine the wafer's quality, wafer stress measurement is essential. The Proforma 300iSA wafer characterization tool offers a powerful solution for wafer stress analysis. It allows for the analysis of a wafer both before and after processing. By comparing these two states, the Proforma 300iSA effectively evaluates the wafer's stress levels and mechanical alterations, providing [...]




