Measuring the Step Height Thickness of Non- Woven Conductive Films
Establishing and maintaining product quality throughout the production process is a common challenge of all manufacturers. How does an organization ensure the optimal output from their production lines, especially in real time? Key to this is strong non-destructive measurement practices that can take place at various points along the production process. The case study below is an example of how this was done at Saint-Gobain to measure the thickness and density of foam materials. They engaged with MTI's team of experts as their current direction was proving cost-prohibitive. Saint-Gobain's R&D organization, led by Dr. Mickael Boinet, found a solution [...]
Ultrasonic Imaging
Ultrasonic Imaging Customer Case The customer is digitizing signals returned from an ultrasonic transducer used in the study of cardiac phenomena. At the moment, a 5 MHz transducer is being used, but the customer wants to upgrade to a 10 MHz transducer in the near future. This transducer will give him better spacial resolution. The customer needs one channel of very fast (100 MSPS), preferably 12-bit A/D conversion which is controlled by an external trigger signal. Bandwidth of the analog front-end of the A/D card or system must be very flat up to 15 or 20 MHz. The application [...]
Measurements with Capacitance Gage for Sub-Nanometer Thermal Expansion Characterization
MTI Instruments contracted an independent Metrology expert to test and verify the performance of a new high resolution capacitance gauge. The Accumeasure HD has passed in house testing where its performance was tested against a commercial laser interferometer (See Application Note). Optical Metrology Solutions (OMS) was chosen based on their extensive experience and proximity to MTI’s manufacturing plant. OMS was tasked with designing a challenging experiment to verify the accuracy and resolution of the MTI Accumeasure HD capacitance system that could also be encountered in a typical customer application. Their experiment explored the ability to measure sub-nonometer thermal expansion [...]
Ultrasound Tissue Imaging
Ultrasound Tissue Imaging Customer Case This customer is building a system to be used as a test station for examining human tissue for disease. Diseased organs differ from healthy organs in ways that can be measured via the echoes of ultrasound transmissions which are passed through the tissues. The customer's system will build a 3D image of the tissue under examination. In order to obtain a clear ultrasound image of the object being studied, the successive data captures have to be aligned to eliminate a distorted image. Jitter which would result from an asynchronous triggering is not acceptable. The [...]
How Aircraft Operators Reduce Downtime While “Sweating the Assets”
In a recent article called “UPS Gives Old Jets New Life,” Bloomberg reports how United Parcel Service (UPS) is replacing the cockpit computers on its Airbus SE freighters in order to reduce downtime, increase productivity, and avoid large capital expenses. Known as “sweating the assets,” this business strategy is also benefitting the two aviation maintenance repair and overhaul (MRO) organizations that are performing the computer upgrades. “Doing such work,” writes Bloomberg’s Thomas Black, “is a huge potential market.” As the article explains, UPS purchased flight computers for over 50 Airbus A300-600 jets some twenty years ago. However, the memory [...]
MTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit
MTI Instruments' PBS-4100+ Series Training Now Eligible for Credit Under William (Bill) O'Brien Aviation Maintenance Technician (AMT) Awards Program Lockport, IL Feb. 23, 2021 /PRNewswire/ -- MTI Instruments, Inc. (MTI Instruments), a wholly-owned subsidiary of Mechanical Technology, Incorporated (OTCQB:MKTY), today announced that its training course on the PBS-4100+ engine vibration measurement and balancing system is now credit-eligible under the Federal Aviation Administration's (FAA's) William (Bill) O'Brien Aviation Maintenance Technician (AMT) Awards Program. With the new credit designation, MTI Instrument's course, "Vibration Analysis and Engine Balancing Using the PBS-4100 System," can earn an eligible individual up to 16 hours of credit towards AMT Awards issued through the FAA [...]
Ultrasonic Medical Imaging System
Ultrasonic Medical Imaging System Customer Case A customer wants to construct an ultrasonic medical imaging system based on a transducer array. A central ultrasonic generation transducer generates a burst of ultrasonic energy which travels towards a tissue specimen. Echoes reflected off the tissue specimen are simultaneously detected by an array of 48 ultrasonic receiver transducers arranged in a dish-like pattern. The customer must simultaneously digitize all 48 signals and download them to PC RAM as quickly as possible. The customer requires 8 bit vertical resolution and would like to sample at 40 MS/s, but 20 MS/s would be acceptable. [...]
MTI’s Accumeasure HD Amplifier vs. Laser Interferometer
Achieving high resolution and accuracy for very small displacement measurements is generally an expensive and complex undertaking. The typical instrument of choice for achieving the accuracy required (picometer resolution with nanometer accuracy) is a laser interferometer. However, MTI Instruments Accumeasure D200HD Amplifier provides exceptional accuracy and stability while coming in at significant cost savings with ease of use. We decided to pit the AccumeasureHD vs a Laser Interferometer and compare results. Specifically, this comparison focuses on minimum expected resolution and the effects of noise on accuracy. Micro positioning applications include measuring the mask height of semiconductor wafers during lithography. [...]
Wafer Backgrinding and Semiconductor Thickness Measurements
Wafer Backgrinding and Thickness Measurements in Semiconductor Manufacturing Wafer backgrinding, also known as wafer thinning or wafer lapping, is a critical step in semiconductor packaging. This process, which involves grinding the backside of a semiconductor wafer, reduces its thickness to enable the stacking of integrated circuits (ICs) and support high-density packaging. The thickness of the wafer plays a crucial role in determining the overall size of the package, an important factor as modern electronics such as smartphones, laptops, and other devices continue to get thinner and more compact. In applications like MEMS (Micro-Electro-Mechanical Systems), the backgrinding process also affects [...]
Laser Scanning Microscope Interface
Laser Scanning Microscope Interface Customer Case This customer needs to interface a scanning laser microscope to their PC so that image data can be acquired and stored. Data is received from the laser microscope via an optical sensor at 1300 line scans per image. Each scan has an 8 ms duration, but 2/3 of that time is scan time and 1/3 is flyback time (dead time). The customer has determined that a 1 us sample width (or faster) would be adequate. There is also a price vs. performance issue - the customer has a tight budget and wants the [...]



