Echocardiography Experiment
Echocardiography Experiment Customer Case This customer is involved in an Echocardiography experiment. The customer already has an ultrasound imager with a built-in A/D converter which can output 12-bit image data which must be analyzed with the customer's proprietary algorithms on a PC platform. In order to accomplish this, it is required to bring 12-bit digital data at 35 MHz clock rate into a PC. This data is arriving in a burst mode with a repeat frequency of 12.8 KHz with 1000 samples arriving in 28 us followed by no data for the next 50 us. There are 512 such [...]
Measuring the Step Height Thickness of Non- Woven Conductive Films
Establishing and maintaining product quality throughout the production process is a common challenge of all manufacturers. How does an organization ensure the optimal output from their production lines, especially in real time? Key to this is strong non-destructive measurement practices that can take place at various points along the production process. The case study below is an example of how this was done at Saint-Gobain to measure the thickness and density of foam materials. They engaged with MTI's team of experts as their current direction was proving cost-prohibitive. Saint-Gobain's R&D organization, led by Dr. Mickael Boinet, found a solution [...]
Ultrasound Imaging
Ultrasound Imaging Customer Case This customer's application involves capturing ultrasound echoes from a medical imaging system, to be used in bedside monitors, defibrillators, intervascular ultrasound, ECG, etc. The live imaging rate is 30 frames per second (fps). Each image frame depicts a full 360-degree circular section. A frame is 240 echoes, so the pulse repeat frequency (PRF) is 7200 Hz, or one echo every 140 us. The customer anticipates signals at 50 MHz with a 50% bandwidth (the passband must extend to at least 75 MHz). The echo duration is 15 us; the signal size is roughly +/- 70 [...]
Ultrasonic Imaging
Ultrasonic Imaging Customer Case The customer is digitizing signals returned from an ultrasonic transducer used in the study of cardiac phenomena. At the moment, a 5 MHz transducer is being used, but the customer wants to upgrade to a 10 MHz transducer in the near future. This transducer will give him better spacial resolution. The customer needs one channel of very fast (100 MSPS), preferably 12-bit A/D conversion which is controlled by an external trigger signal. Bandwidth of the analog front-end of the A/D card or system must be very flat up to 15 or 20 MHz. The application [...]
Ultrasound Tissue Imaging
Ultrasound Tissue Imaging Customer Case This customer is building a system to be used as a test station for examining human tissue for disease. Diseased organs differ from healthy organs in ways that can be measured via the echoes of ultrasound transmissions which are passed through the tissues. The customer's system will build a 3D image of the tissue under examination. In order to obtain a clear ultrasound image of the object being studied, the successive data captures have to be aligned to eliminate a distorted image. Jitter which would result from an asynchronous triggering is not acceptable. The [...]
Ultrasonic Medical Imaging System
Ultrasonic Medical Imaging System Customer Case A customer wants to construct an ultrasonic medical imaging system based on a transducer array. A central ultrasonic generation transducer generates a burst of ultrasonic energy which travels towards a tissue specimen. Echoes reflected off the tissue specimen are simultaneously detected by an array of 48 ultrasonic receiver transducers arranged in a dish-like pattern. The customer must simultaneously digitize all 48 signals and download them to PC RAM as quickly as possible. The customer requires 8 bit vertical resolution and would like to sample at 40 MS/s, but 20 MS/s would be acceptable. [...]
Intra-Vascular Ultrasound
Intra-Vascular Ultrasound Customer Case The customer does intra-vascular diagnostic ultrasound. In this novel technique, an ultrasonic catheter is guided through a patient's blood vessel. Throughout its helical or corkscrew-like path, the ultrasonic transducer-tipped catheter emits bursts of ultrasonic energy. Reflections from the vessel wall return into the transducer and can be used to characterize such features as plaque deposits. The customer wishes to resolve features as small as 3 mm. The amount of time, D t, required for ultrasound to reflect off an interface that is a distance x away and return to the transducer is: D t = [...]
Deep Capture of Medical Sonography Signals
Deep Capture of Medical Sonography Signals Customer Case Medical sonography refers to the use of reflected ultrasonic echoes to image a patient's internal organs. A customer has a commercial medical diagnostic ultrasound system. During its operation, an external probe is placed upon the patient. An ultrasonic transducer within the probe head mechanically scans in a linear frame pattern at a rate of approximately 22 frames/sec. The transducer generates a sharp ultrasonic pulse into the patient and the same transducer detects reflected echoes from various tissue interfaces. In normal operation, the system processes the ultrasonic echoes in a prescribed fashion [...]
Wafer Backgrinding and Semiconductor Thickness Measurements GalleryWafer Backgrinding and Semiconductor Thickness Measurements
Application Notes-MTI, Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, News-MTI-Instrumentation, News-MTI-Metrology, Products-MTI-Capacitance, Products-MTI-Semiconductor/Metrology, Z-REPUB, z1
Wafer Backgrinding and Semiconductor Thickness Measurements
Wafer Backgrinding and Thickness Measurements in Semiconductor Manufacturing Wafer backgrinding, also known as wafer thinning or wafer lapping, is a critical step in semiconductor packaging. This process, which involves grinding the backside of a semiconductor wafer, reduces its thickness to enable the stacking of integrated circuits (ICs) and support high-density packaging. The thickness of the wafer plays a crucial role in determining the overall size of the package, an important factor as modern electronics such as smartphones, laptops, and other devices continue to get thinner and more compact. In applications like MEMS (Micro-Electro-Mechanical Systems), the backgrinding process also affects [...]
Laser Scanning Microscope Interface
Laser Scanning Microscope Interface Customer Case This customer needs to interface a scanning laser microscope to their PC so that image data can be acquired and stored. Data is received from the laser microscope via an optical sensor at 1300 line scans per image. Each scan has an 8 ms duration, but 2/3 of that time is scan time and 1/3 is flyback time (dead time). The customer has determined that a 1 us sample width (or faster) would be adequate. There is also a price vs. performance issue - the customer has a tight budget and wants the [...]