PAxx Power Analyzers using External Current Sensors: Application Notes
Current Sensors use two main techniques. A current transformer divides current. So for instance a 100:1 current transformer would see an input of 10A and output 100mA. Note that this technique is only useful for AC current. When using a current transformer you can directly input the current into one of our internal shunts as long as you stay within the current limitations of the input. Notice that current transformers are inductive so they act as a low pass filter. If you use a current transformer it is important to select a transformer that will work accurately at your frequency [...]
Measuring the Step Height Thickness of Non- Woven Conductive Films
Establishing and maintaining product quality throughout the production process is a common challenge of all manufacturers. How does an organization ensure the optimal output from their production lines, especially in real time? Key to this is strong non-destructive measurement practices that can take place at various points along the production process. The case study below is an example of how this was done at Saint-Gobain to measure the thickness and density of foam materials. They engaged with MTI's team of experts as their current direction was proving cost-prohibitive. Saint-Gobain's R&D organization, led by Dr. Mickael Boinet, found a solution [...]
Wafer Backgrinding and Semiconductor Thickness Measurements GalleryWafer Backgrinding and Semiconductor Thickness Measurements
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Wafer Backgrinding and Semiconductor Thickness Measurements
Wafer Backgrinding and Thickness Measurements in Semiconductor Manufacturing Wafer backgrinding, also known as wafer thinning or wafer lapping, is a critical step in semiconductor packaging. This process, which involves grinding the backside of a semiconductor wafer, reduces its thickness to enable the stacking of integrated circuits (ICs) and support high-density packaging. The thickness of the wafer plays a crucial role in determining the overall size of the package, an important factor as modern electronics such as smartphones, laptops, and other devices continue to get thinner and more compact. In applications like MEMS (Micro-Electro-Mechanical Systems), the backgrinding process also affects [...]
Silicon Carbide vs. Silicon in EV Power Electronics GallerySilicon Carbide vs. Silicon in EV Power Electronics
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Silicon Carbide vs. Silicon in EV Power Electronics
Compare silicon carbide vs. silicon for electric vehicle (EV) power electronics and learn about SiC wafer measurement. As demand for electric vehicles (EVs) continues to grow, manufacturers are comparing two semiconductor technologies, silicon carbide and silicon, for power electronics applications. Silicon carbide (SiC) provides the high temperature resistance, low power consumption, rigidity, and support for smaller, thinner designs that EV power electronics need. Examples of SiC’s current applications include on-board DC/DC converters, off-board DC fast chargers, on-board battery chargers, EV powertrains, and automotive lighting for LEDs. According to Automotive World, SiC technology could also drive future EV innovations [...]
MTI Instruments Fulfills Historic Order for the United States Air Force GalleryMTI Instruments Fulfills Historic Order for the United States Air Force
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MTI Instruments Fulfills Historic Order for the United States Air Force
Lockport, IL, November 16, 2020 — MTI Instruments, Inc. (“MTI Instruments”), the operating subsidiary of Mechanical Technology, Incorporated (OTC Pink: MKTY), announces the completion of its historic order for the United States Air Force, a $3.3 million contract awarded publicly in May 2020 that includes 52 PBS-4100+ engine vibration measurement and balancing systems. This order was made pursuant to the multi-year contract entered into by MTI Instruments and the United States Air Force in July 2016 and marks the single largest order of PBS-4100+ Systems received by MTI Instruments to date. MTI fulfilled the order in its entirety with [...]
EV Batteries Need Thickness Gauging for Lower Costs and Higher Performance GalleryEV Batteries Need Thickness Gauging for Lower Costs and Higher Performance
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EV Batteries Need Thickness Gauging for Lower Costs and Higher Performance
EV batteries need to cost less and last longer. Until the e-mobility industry solves these challenges, electric vehicle (EV) adoption won’t match the hype that’s driven by Tesla, the established automakers, and a host of startups who are attracting investors. According to Axios, the expense of owning an electric vehicle will exceed that of owning a conventional one until EV batteries cost less than $100/KWh to produce. Unfortunately, the EV industry isn’t expected to hit that target for another ten years. Yet, there is some encouraging news. Less expensive and better performing EV batteries are just a few years [...]
Transducer Selection for High Resolution Applications GalleryTransducer Selection for High Resolution Applications
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Transducer Selection for High Resolution Applications
High resolution applications do not always require an interferometer. If you want to make accurate measurements in the micron to picometer range, then an MTI Digital Accumeasure D100 HD or D200 system may be what you need. Laser interferometers can sell for more than $15,000 and be difficult to setup. For example, you may have to buy additional optics to guarantee a good return signal since the laser beam must reflect off a mirror surface or precision retro reflector in order for the beam to re-enter the interferometer’s optics at less than a degree of reflection angle. The downsides [...]
High Resolution Semiconductor Wafer Measurements at Lower Costs
MTI's Proforma technology characterizes semiconductor wafers in terms of bow and warp, thickness, total thickness variation (TTV) and center thickness. Until recently, semiconductor wafer measurements at resolutions less than 100 µm were cost-prohibitive. Moreover, only expensive devices such as interferometers were capable of these measurements. Today, the semiconductor industry can use capacitance gauges instead of laser interferometers to achieve high resolution at fraction of the cost. Much like affordable CCD cameras transformed and expanded the market for video, cost-effective capacitance is disrupting the semiconductor wafer measurement market and creating new opportunities for quality testing and validation. The [...]
Measure Wafer Bow, Warp and TTV with Capacitance GalleryMeasure Wafer Bow, Warp and TTV with Capacitance
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Measure Wafer Bow, Warp and TTV with Capacitance
The flatness of silicon wafers used to manufacture integrated circuits is controlled to tight tolerances to help ensure that the whole wafer is sufficiently flat for lithographic processing. To ensure your wafer manufacturing process is within tolerance, you need to measure the wafers being produced. Various measurement techniques exist to verify process tolerances and eliminate expensive scrap wafers. Non-contact capacitive sensing is a highly precise and cost-effective means to measure wafer flatness, bow, warp, and total thickness variation (TTV). MTI Instruments’ Proforma 300i and 300iSA systems use capacitance sensors to improve yields while reducing costs through better dimensional control of [...]
How to Measure Dielectric Separator Thickness in EV Batteries GalleryHow to Measure Dielectric Separator Thickness in EV Batteries
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How to Measure Dielectric Separator Thickness in EV Batteries
The International Energy Agency predicts that as many as 125 million electric vehicles (EVs) will be on the road by 2030. At the heart of these electric cars, trucks, and buses is the lithium-ion (Li-ion) battery, a type of rechargeable battery with high energy density and low self-discharge. The plates in Li-ion batteries consist of lithium compounds that are applied to either a copper plate substrate (cathode) or an aluminum substrate (anode). In turn, these two plates are separated by a dielectric separator. All of the layers in an EV battery are extremely thin. In fact, the cathode and [...]