Laser Spectroscopy
Laser Spectroscopy Customer Case An academic researcher is studying the attenuation properties of different materials inside Laser cavities for applications in Laser Spectroscopy. The Laser pulses are generated by one Laser, and are then transmitted by mirrors into another cavity filled with gaseous material. In the second cavity, the light pulses are continuously reflected by opposite mirrors and their intensities are measured by a transducer which converts them into decaying pulses of 30 nanosecond width. The decay takes about 40 microseconds to settle. The researcher is required to capture the decaying pulses and save the captured data onto the [...]
How Aircraft Operators Reduce Downtime While “Sweating the Assets” GalleryHow Aircraft Operators Reduce Downtime While “Sweating the Assets”
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How Aircraft Operators Reduce Downtime While “Sweating the Assets”
In a recent article called “UPS Gives Old Jets New Life,” Bloomberg reports how United Parcel Service (UPS) is replacing the cockpit computers on its Airbus SE freighters in order to reduce downtime, increase productivity, and avoid large capital expenses. Known as “sweating the assets,” this business strategy is also benefitting the two aviation maintenance repair and overhaul (MRO) organizations that are performing the computer upgrades. “Doing such work,” writes Bloomberg’s Thomas Black, “is a huge potential market.” As the article explains, UPS purchased flight computers for over 50 Airbus A300-600 jets some twenty years ago. However, the memory [...]
MTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit GalleryMTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit
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MTI Instruments’ PBS-4100+ Series Training Eligible for FAA Training Credit
MTI Instruments' PBS-4100+ Series Training Now Eligible for Credit Under William (Bill) O'Brien Aviation Maintenance Technician (AMT) Awards Program Lockport, IL Feb. 23, 2021 /PRNewswire/ -- MTI Instruments, Inc. (MTI Instruments), a wholly-owned subsidiary of Mechanical Technology, Incorporated (OTCQB:MKTY), today announced that its training course on the PBS-4100+ engine vibration measurement and balancing system is now credit-eligible under the Federal Aviation Administration's (FAA's) William (Bill) O'Brien Aviation Maintenance Technician (AMT) Awards Program. With the new credit designation, MTI Instrument's course, "Vibration Analysis and Engine Balancing Using the PBS-4100 System," can earn an eligible individual up to 16 hours of credit towards AMT Awards issued through the FAA [...]
Laser Transient Absorption Spectroscopy
Laser Transient Absorption Spectroscopy Customer Case The customer's setup is a scientific application in which transient signals from a Laser Absorption Spectroscope are transferred to a computer. The laser power is modified in steps and the process is repeated. The measurement sensitivity is limited by noise generated by the current digitizer. The customer wants to capture and continuously average very small pulse responses. The lowest signal pulse height is 0.5 milliVolts and can range up to 2 mV. The duration of each response pulse is 1 to 10 microseconds. The Pulse Repetition Frequency (PRF) is 10 Hz. The customer's [...]
Charge-Couple Device (CCD) Data Capture
Charge-Couple Device (CCD) Data Capture Customer Case The client is involved in developing a charge-couple device (CCD) based system to function as an imaging spectrometer. The spectrometer will image 5x5 mm squares that will form a 50 mm line or 1.5x1.5 mm squares in a 15 mm line. The line is to be imaged on a CCD chip. In this application the customer needs to simultaneously acquire 10 independent spectra that are 200 pixels long each with 12-bit resolution. The read-out rate is 1000 frames per second for a period of 10 seconds. The 12-bit data is to be [...]
Wafer Backgrinding and Semiconductor Thickness Measurements GalleryWafer Backgrinding and Semiconductor Thickness Measurements
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Wafer Backgrinding and Semiconductor Thickness Measurements
Wafer Backgrinding and Thickness Measurements in Semiconductor Manufacturing Wafer backgrinding, also known as wafer thinning or wafer lapping, is a critical step in semiconductor packaging. This process, which involves grinding the backside of a semiconductor wafer, reduces its thickness to enable the stacking of integrated circuits (ICs) and support high-density packaging. The thickness of the wafer plays a crucial role in determining the overall size of the package, an important factor as modern electronics such as smartphones, laptops, and other devices continue to get thinner and more compact. In applications like MEMS (Micro-Electro-Mechanical Systems), the backgrinding process also affects [...]
Laser Measurement & Characterization of Flat Panel Displays
Laser Measurement & Characterization of Flat Panel Displays Customer Case This customer's application involves the characterization of flat panel displays (used in laptop computers, computer game displays, etc.) via laser scanning. The laser is bounced off a number of mirrors and then through lenses, from which it is scattered. The scattered laser light must then be analyzed in order to determine the quality of the flat panel display. This laser measurement system is used not only by flat panel display industries, but also by disk drive manufacturers to analyze platter quality and, in the near future, for characterizing silicon [...]
Laser Signals Striking Silicon-Diode Target
Laser Signals Striking Silicon-Diode Target Customer Case The customer wants to capture the output of some silicon diodes looking at a laser target. The typical signal is anywhere from 20mv to 1V in amplitude and 0 to 15ns in length. There are up to 16 of these diodes that are looking at the same target. Each diode has a different filter so the post-trigger depth and amplitude-scale must be user-adjustable. Their main interest is to sample and digitize the signals for archiving, with later retrieval and plotting. Fancy software is not needed for display as the data is gathered [...]
Silicon Carbide vs. Silicon in EV Power Electronics GallerySilicon Carbide vs. Silicon in EV Power Electronics
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Silicon Carbide vs. Silicon in EV Power Electronics
Compare silicon carbide vs. silicon for electric vehicle (EV) power electronics and learn about SiC wafer measurement. As demand for electric vehicles (EVs) continues to grow, manufacturers are comparing two semiconductor technologies, silicon carbide and silicon, for power electronics applications. Silicon carbide (SiC) provides the high temperature resistance, low power consumption, rigidity, and support for smaller, thinner designs that EV power electronics need. Examples of SiC’s current applications include on-board DC/DC converters, off-board DC fast chargers, on-board battery chargers, EV powertrains, and automotive lighting for LEDs. According to Automotive World, SiC technology could also drive future EV innovations [...]
Press Release: Vitrek Highlights Updated & Expanded Sections of their Website
Vitrek Highlights Updated & Expanded Sections of their Website The innovative high voltage testing and measurement company offers numerous resources for their customers on their website vitrek.com. […]