Aircraft Vibration Analysis and Measurement Techniques GalleryAircraft Vibration Analysis and Measurement Techniques
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Aircraft Vibration Analysis and Measurement Techniques
Aircraft engine vibration is a critical indicator of engine health and overall flight safety. While some level of vibration in aircraft is expected during normal operations, excessive or abnormal vibrations often signal underlying mechanical issues that demand immediate attention. With modern jet engines becoming more complex, real-time vibration monitoring and precise balancing tools are essential for both aircraft maintenance teams and aviation diagnostics specialists. Aircraft vibration measurement tools detect and quantify these issues, enabling maintenance teams to take corrective actions before minor imbalances escalate into major faults. Types of Aircraft Vibrations There are two main categories of aircraft vibrations: [...]
How Capacitive Measurement Can Help Reduce Packaging Waste
Product packaging is often made of lightweight polymeric foams or plastic sheets and films. These materials are relatively inexpensive, but manufacturers still want to minimize waste and maximize yields. Across high volumes of low-cost materials, even a small per-unit savings can become significant, especially as the price of petroleum – a key ingredient in many polymers – continues to rise. For companies with environmental sustainability efforts, there are other important considerations as well. The excessive use of packaging materials can contribute to environmental pollution, especially with polymers that are slow to degrade. Yet, materials such as plastic sheets and [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
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Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]
How Often Should Vibration Analysis Be Performed?
How Often Should Vibration Analysis Be Performed? Once a customer takes delivery of a PBS system and learns how to use it, the next logical question is: “How often should we use it?” At a minimum, your approved maintenance program (whether it’s a program developed by your operation, or the maintenance procedures outlined by the engine/airframe manufacturer) will tell you about the intervals at which to perform a vibration analysis. Usually, there is a procedure to specify how an engine vibration analysis and balance need be only completed when squawked by a pilot or after the completion of maintenance [...]
Contact vs. Non-Contact Measurement and Linear Displacement Sensors GalleryContact vs. Non-Contact Measurement and Linear Displacement Sensors
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Contact vs. Non-Contact Measurement and Linear Displacement Sensors
Contact vs. Non-Contact Measurements Choosing between a contact measurement system and a non-contact measurement system requires careful evaluation of your application’s performance needs, material properties, environmental conditions, and measurement goals. Each system type offers unique advantages- and understanding these distinctions can help you make a more informed decision. Let's explores how contact and non-contact measurement techniques work, their strengths and limitations, and where they’re best applied. What Are Contact Measurement Systems? Contact measurement systems involve tools and sensors that physically touch the object to determine various physical characteristics. These systems are widely used in dimensional metrology, offering high precision, [...]
Foam Density Measurement: Capacitance Sensors vs. Nuclear Gauges
This application note from MTI Instruments compares two technologies for measuring foam density: capacitance sensors and nuclear gauges. It examines the basic operating principles of each technology and explains why capacitance measurement is recommended for in-line measurement during foam manufacturing. Capacitance Sensors Capacitive probes are non-contact devices that use electric fields to measure foam density. In combination with a thickness value, a density measurement may be calculated. These probes consist of a capacitance sensor inside of a protective housing and are part of a larger measurement system that includes amplifiers, cables, and software. With parallel plate capacitance, the capacitance probe [...]
Using Capacitance Sensors for Non-Conductive Material Measurement GalleryUsing Capacitance Sensors for Non-Conductive Material Measurement
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Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Why Demand for SiC Wafers is Soaring and Durable GalleryWhy Demand for SiC Wafers is Soaring and Durable
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Why Demand for SiC Wafers is Soaring and Durable
Silicon carbide (SiC) wafers are in high demand, particularly in high-temperature applications. Silicon carbide (SiC), a semiconductor material made of both silicon and carbon, can withstand extreme temperatures of up to 2700°C. Often referred to as carborundum, SiC’s unique properties also make it a key material in non-electronic applications such as bulletproof vests, extrusion dies, sandpaper, and high-performance disc brakes. In the electronics industry, SiC wafers are crucial for devices operating under high temperatures, high voltages, or both. For example, they are used in electric vehicle (EV) power electronics, 5G communication systems, and LED technology, making SiC a material [...]
Wafer Stress Analysis Using the 300iSA
Wafer Stress Analysis Using MTI Instruments Proforma 300iSA Wafer processing involves several stages that can lead to mechanical changes in the wafer structure. These changes, or stresses, may result in deformities, making the wafer either unusable or only marginally usable. To evaluate these stresses and determine the wafer's quality, wafer stress measurement is essential. The Proforma 300iSA wafer characterization tool offers a powerful solution for wafer stress analysis. It allows for the analysis of a wafer both before and after processing. By comparing these two states, the Proforma 300iSA effectively evaluates the wafer's stress levels and mechanical alterations, providing [...]
THICKNESS INFORMATION OF COMPOSITE MATERIALS
Composite materials consist of two or more materials which include a substrate or base material such as paper, cotton cloth, or glass cloth along with a resin or adhesive such as epoxy, melamine, or silicone. To make a thermoset laminate, the base material is coated with the adhesive so that layers of material can be pressed under heat and pressure into sheet form. The Problem: Composite material thickness needed to be verified prior to forming or machining. Due to the size of the sheets typical measurement techniques were not suitable. A consistent method to accurately measure the board thickness [...]