WAFER MEASUREMENT – UNGROUNDED
Industry Semiconductor Applications Wafer Measurement – Ungrounded Measurement Type Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
PHOTOLITHOGRAPHY USING CAPACITANCE SENSORS
Industry Semiconductor Applications Lithography Optics Position Focus Measurement Type Positioning Description When it comes to photolithography, how accurate are our sensors? Photo by D. Carr and H. Craighead, Cornell - The world’s smallest guitar is 10 micrometers long — about the size of a single cell — with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]
Case-In-Point: High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities GalleryCase-In-Point: High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities
Application Notes-MTI, Brand-MTI, Industry-Automotive, Industry-Battery, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Products-MTI-Capacitance, Z-REPUB, z1
Case-In-Point: High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities
High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities EV Battery manufacturers need to measure EV battery plate thickness with a high degree of precision (repeatable <2um accuracy and resolution) to optimize manufacturing efficiencies while maintaining uniform cell capacity and minimizing waste. The MTI Accumeasure System provides an effective means of monitoring plate thickness achieving sub 2um accuracy with high repeatability Introduction The rapidly expanding demand for electric vehicles is driving advances in the production of rechargeable cells that comprise the first stage in the composition of EV battery packs. Individual Li-Ion cells are combined to form [...]
GaGe Application Note: Creating a Data Link Signal Integrity Test Platform
Creating a Data Link Signal Integrity Test PlatformThis application note describes how a manufacturer of data links utilizes GaGe Instruments’ PC-basedhigh-speed data acquisition digitizers to perform production-level signal integrity testing. Data Link Device Testing The data link device under test (Figure 1) is characterized by comparing test signals that are input to the link with signals measured at the link output. Differences between these two test signals indicate a degradation by the link during transmission. The input and output test signals require sampling at 1 GS/s (GigaSample per second) with at least 14-bit vertical resolution. Both signals must [...]
Creating a Compensation File for a Recipe for the Proforma 300iSA – Video GalleryCreating a Compensation File for a Recipe for the Proforma 300iSA – Video
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MTI Application Note: Testing for Connector Failure Due To Vibration or Shock GalleryMTI Application Note: Testing for Connector Failure Due To Vibration or Shock
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MTI Application Note: Testing for Connector Failure Due To Vibration or Shock
Testing for Connector Failure Due to Vibration or Shock Mobile Communications Equipment Needs Reliable Connectors That Will Not Disconnect with Shock or Vibration Introduction A large multinational company approached MTI to provide a sensor capable of measuring displacement that also wouldn’t load the target (connector). Shock and vibration testing would span 2-15G and the target connectors were very small. Application MTI’s 2100 optical displacement sensor system is ideal for this kind of application because very small probes can be used and they measure displacement via reflected light. [...]
GaGe Application Note: Creating a Data Link Signal Integrity Test Platform GalleryGaGe Application Note: Creating a Data Link Signal Integrity Test Platform
App Notes, Application Notes-GaGe, Brand-GaGe, Industry-Aerospace, Industry-Compliance Testing, Industry-Consumer Products, Industry-Education, Industry-Electronics, Industry-Government/Military, Industry-Manufacturing, News-GaGe, Products-GaGe, z1
GaGe Application Note: Creating a Data Link Signal Integrity Test Platform
Download a PDF Copy of this App Note Data Link Device Testing The data link device under test (Figure 1) is characterized by comparing test signals that are input to the link with signals measured at the link output. Differences between these two test signals indicate a degradation by the link during transmission. Figure 1. Two test platforms (PCIe and PXIe, respectively) transmit and receive the data link test signals. GaGe RazorMax high-speed data acquisition cards record the data for signal integrity comparison. The input and output test signals require sampling at 1 GS/s (GigaSample per second) [...]