MTI’s Wireless Gap Measurement Probe System Is Ideal for Rotating Machinery GalleryMTI’s Wireless Gap Measurement Probe System Is Ideal for Rotating Machinery
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MTI’s Wireless Gap Measurement Probe System Is Ideal for Rotating Machinery
The Accumeasure capacitance probe system offers major improvement over conventional eddy current probes; network up to four probes per system to deliver rich geometrical in-situ measurements in a variety of industry standard formats. Lockport, IL—June 28, 2022—MTI Instruments, a US-based manufacturer of advanced test and measurement equipment, announces the introduction of its Accumeasure Wireless Gap Measurement Probe System. The system consists of up to four, battery-powered, wireless capacitance probes paired via Bluetooth to their receiving device. The wireless capability and compact form factor of the battery-powered probes are designed specifically to measure gap in difficult-to-reach or [...]
The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology GalleryThe Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
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The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
This is the third of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The second article examines the cost of failing to inspect semiconductor wafers. Fully automated systems that can load, scan, and unload wafers are fast, convenient, and efficient at high volumes. They’re useful for checking every wafer in every batch, but these systems are expensive. Semi-automated and manual systems cost significantly less and are generally used for lower volumes; however, they’re also easy-to-use and can make fast, accurate measurements that support production flow. Semi-automated and [...]
Why Disc Geometry Matters In Wafer Production GalleryWhy Disc Geometry Matters In Wafer Production
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Why Disc Geometry Matters In Wafer Production
This is the first of three articles in Semiconductor Wafer Measurement for Increased Profitability. The second article examines the cost of failing to inspect semiconductor wafers. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec after cutting, it may be possible to reprocess the wafer. Cutting is only the first [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
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Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]
Contact vs. Non-Contact Measurement and Linear Displacement Sensors GalleryContact vs. Non-Contact Measurement and Linear Displacement Sensors
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Contact vs. Non-Contact Measurement and Linear Displacement Sensors
Contact vs. Non-Contact Measurements Choosing between a contact measurement system and a non-contact measurement system requires careful evaluation of your application’s performance needs, material properties, environmental conditions, and measurement goals. Each system type offers unique advantages- and understanding these distinctions can help you make a more informed decision. Let's explores how contact and non-contact measurement techniques work, their strengths and limitations, and where they’re best applied. What Are Contact Measurement Systems? Contact measurement systems involve tools and sensors that physically touch the object to determine various physical characteristics. These systems are widely used in dimensional metrology, offering high precision, [...]
Using Capacitance Sensors for Non-Conductive Material Measurement GalleryUsing Capacitance Sensors for Non-Conductive Material Measurement
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Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Why Demand for SiC Wafers is Soaring and Durable GalleryWhy Demand for SiC Wafers is Soaring and Durable
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Why Demand for SiC Wafers is Soaring and Durable
Silicon carbide (SiC) wafers are in high demand, particularly in high-temperature applications. Silicon carbide (SiC), a semiconductor material made of both silicon and carbon, can withstand extreme temperatures of up to 2700°C. Often referred to as carborundum, SiC’s unique properties also make it a key material in non-electronic applications such as bulletproof vests, extrusion dies, sandpaper, and high-performance disc brakes. In the electronics industry, SiC wafers are crucial for devices operating under high temperatures, high voltages, or both. For example, they are used in electric vehicle (EV) power electronics, 5G communication systems, and LED technology, making SiC a material [...]
Wafer Stress Analysis Using the 300iSA
Wafer Stress Analysis Using MTI Instruments Proforma 300iSA Wafer processing involves several stages that can lead to mechanical changes in the wafer structure. These changes, or stresses, may result in deformities, making the wafer either unusable or only marginally usable. To evaluate these stresses and determine the wafer's quality, wafer stress measurement is essential. The Proforma 300iSA wafer characterization tool offers a powerful solution for wafer stress analysis. It allows for the analysis of a wafer both before and after processing. By comparing these two states, the Proforma 300iSA effectively evaluates the wafer's stress levels and mechanical alterations, providing [...]
CMP and Capacitance-Based Semiconductor Wafer Measurement GalleryCMP and Capacitance-Based Semiconductor Wafer Measurement
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CMP and Capacitance-Based Semiconductor Wafer Measurement
Chemical mechanical polishing (CMP) uses chemical oxidation and mechanical abrasion to selectively remove material from semiconductor wafers in order to achieve very high levels of planarity. The planarity, or flatness, of these wafers is important for optical lithography, a microfabrication technique that produces integrated circuits (ICs) by transferring a geometric pattern from a photomask to a light-sensitive chemical photoresist. Also known as photolithography or UV lithography, optical lithography can produce a geometric pattern on a thin film or directly onto the substrate. Semiconductor Wafer Measurements: Flatness and Shape During optical lithography, variations in wafer flatness must be smaller than [...]
MEMS and Capacitance-Based Semiconductor Wafer Measurement GalleryMEMS and Capacitance-Based Semiconductor Wafer Measurement
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MEMS and Capacitance-Based Semiconductor Wafer Measurement
MEMS Technology and Capacitance-Based Wafer Measurement Micro-electrical-mechanical systems (MEMS) are tiny devices that house electrical and mechanical components on a single silicon chip or integrated circuit (IC). They integrate mechanical structures with electronics that are normally fabricated with complementary metal-oxide-semiconductor (CMOS) technologies. In addition to miniaturization, the benefits of MEMS include expanded functionalities at lower cost and with improved performance and reliability. With MEMS devices, critical physical dimensions range from smaller than one micron (µ) to larger than several millimeters (mm). In complex systems, multiple moving elements may be controlled by integrated electronics. Examples of the mechanical components in [...]