MTI Application Note: How to Achieve GalleryMTI Application Note: How to Achieve <1um Accuracy When Measuring Roller Gap
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MTI Application Note: How to Achieve <1um Accuracy When Measuring Roller Gap
How to Achieve <1um Accuracy When Measuring Roller Gap Roller Gap Measurement with MTI Digital Accumeasure Capacitive Probes Many roll-to-roll finishing processes typically use a calender, or series of hard pressure rollers, to deliver smooth, high-quality products of plastic, textile, or paper (Fig 1). Ensuring a consistent material thickness, however, depends on the ability to monitor, and maintain, a precise gap between rollers. This application note describes a quick and easy means for roller gap measurement. Problem How to measure the small gap between rollers to keep track of product thickness. Typically, it’s not possible to [...]
MTI Application Note: Security of Flight Doors Improved Through Use of MTI-2100 Fotonic Sensor GalleryMTI Application Note: Security of Flight Doors Improved Through Use of MTI-2100 Fotonic Sensor
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MTI Application Note: Security of Flight Doors Improved Through Use of MTI-2100 Fotonic Sensor
Security of Flight Doors Improved Through Use of MTI-2100 Fotonic Sensor Increased Safety & Reliability for Aircraft Cockpit Doors NTSB safety records point to numerous incidents involving cockpit door locking/unlocking mechanisms, either accidentally opening/closing or not operating fact enough upon command. Learn how one key industry supplier leveraged Fotonic Sensors to increase reliability and safety for their door locking mechanisms. Introduction Figure 1. Example of a typical cockpit door strike NTSB safety records point to numerous incidents involving cockpit door locking/unlocking mechanisms, either accidentally opening/closing or not operating fast enough upon command. In the assembly [...]
MTI Case-In-Point: Gap Monitor Keeps Wind Turbines Running
Gap Monitor Keeps Wind Turbines Running System helps operators minimize downtime and protect against catastrophic failure Introduction Wind turbine production has been steadily increasing to meet growing demand for renewable energy. As power outputs and the number of installations climb, maintenance becomes ever more critical. Operators want to minimize downtime and protect against catastrophic failure. The ability to predict when maintenance will be required can go a long way to ensure these goals are met. Challenge A leading manufacturer of wind turbine power generators approached MTI for critical gap monitoring sensors. Specifically, the company wished to monitor [...]
MTI Application Note: Testing for Connector Failure Due To Vibration or Shock GalleryMTI Application Note: Testing for Connector Failure Due To Vibration or Shock
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MTI Application Note: Testing for Connector Failure Due To Vibration or Shock
Testing for Connector Failure Due to Vibration or Shock Mobile Communications Equipment Needs Reliable Connectors That Will Not Disconnect with Shock or Vibration Introduction A large multinational company approached MTI to provide a sensor capable of measuring displacement that also wouldn’t load the target (connector). Shock and vibration testing would span 2-15G and the target connectors were very small. Application MTI’s 2100 optical displacement sensor system is ideal for this kind of application because very small probes can be used and they measure displacement via reflected light. [...]
A Comprehensive Guide to Non-Contact Sensors and Their Applications GalleryA Comprehensive Guide to Non-Contact Sensors and Their Applications
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A Comprehensive Guide to Non-Contact Sensors and Their Applications
Sensors, both contact and non-contact, are crucial devices that allow the monitoring, detection, and reaction to conditions in an environment or within a process or piece of equipment. While myriad types of sensors exist and are designed to monitor varying conditions, all of them can be characterized as being one of two types — contact sensors and non-contact sensors. We’ll focus on the latter, diving into different technologies, types, and applications of non-contact sensor technology; but first, let’s explore what differentiates contact and non-contact sensors. Contact vs. Non-Contact Sensors: What’s the Difference? Measuring, monitoring, or detecting a particular condition [...]
The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology GalleryThe Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
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The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
This is the third of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The second article examines the cost of failing to inspect semiconductor wafers. Fully automated systems that can load, scan, and unload wafers are fast, convenient, and efficient at high volumes. They’re useful for checking every wafer in every batch, but these systems are expensive. Semi-automated and manual systems cost significantly less and are generally used for lower volumes; however, they’re also easy-to-use and can make fast, accurate measurements that support production flow. Semi-automated and [...]
Why Disc Geometry Matters In Wafer Production GalleryWhy Disc Geometry Matters In Wafer Production
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Why Disc Geometry Matters In Wafer Production
This is the first of three articles in Semiconductor Wafer Measurement for Increased Profitability. The second article examines the cost of failing to inspect semiconductor wafers. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec after cutting, it may be possible to reprocess the wafer. Cutting is only the first [...]
How Capacitive Measurement Can Help Reduce Packaging Waste
Product packaging is often made of lightweight polymeric foams or plastic sheets and films. These materials are relatively inexpensive, but manufacturers still want to minimize waste and maximize yields. Across high volumes of low-cost materials, even a small per-unit savings can become significant, especially as the price of petroleum – a key ingredient in many polymers – continues to rise. For companies with environmental sustainability efforts, there are other important considerations as well. The excessive use of packaging materials can contribute to environmental pollution, especially with polymers that are slow to degrade. Yet, materials such as plastic sheets and [...]
Non-Contact Displacement Sensors for Detection and Measurement
Non-contact displacement sensors are designed to detect or measure physical properties such as linear displacement, thickness, proximity, and distance without physically touching the target. By emitting various forms of energy, such as capacitance, fiber optic, or laser triangulation, these sensors capture highly accurate readings without physically touching the object. This contrasts with traditional contact sensors, which rely on direct mechanical contact to gauge displacement or other physical properties. Benefits of Non-Contact vs. Contact Displacement Sensors Compared to contact sensors, non-contact displacement sensors offer faster response times, higher sampling rates, and minimal interference with the object being measured. They are [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
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Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]