Torque Converter
Industry Automotive Applications Torque Converter Measurement Type Surface Description Since minute defects in the torque converter casing wall thickness can result in unacceptable and dangerous torque converter expansion, a precision measurement system was needed to measure the impeller hub displacement and thus the torque converter axial displacement. An AC dynamometer would be required to spin the torque converter at a high rate of speed while a fast response hydraulic system is needed to pressurize the converter to pressures up to 150 psi. MTI’s MicroTrak laser sensor was selected because it offered [...]
FIBER OPTIC PROBES MEASURE STATOR BAR VIBRATION
[Application Note 11718] One of the primary concerns in large generator design is vibration. Excessive vibration can lead to premature breakdown of insulation and other materials, ultimately resulting in early failure of the generator itself. The Problem A leading manufacturer of power generating equipment required a sensing system able to measure stator bar vibration in a partial generator mockup. Specifically, the company’s multi-day testing program demanded a sensing system that was immune to the large magnetic field generated by live stator bars capable of withstanding high heat built up from prolonged testing, and compatible with a proprietary stator bar [...]
The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology GalleryThe Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
Application Notes-MTI, Brand-MTI, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, News-MTI-Metrology, Products-MTI-Semiconductor/Metrology, z1
The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology
This is the third of three articles in Semiconductor Wafer Measurement for Increased Profitability. The first article in this series explains why disc geometry matters. The second article examines the cost of failing to inspect semiconductor wafers. Fully automated systems that can load, scan, and unload wafers are fast, convenient, and efficient at high volumes. They’re useful for checking every wafer in every batch, but these systems are expensive. Semi-automated and manual systems cost significantly less and are generally used for lower volumes; however, they’re also easy-to-use and can make fast, accurate measurements that support production flow. Semi-automated and [...]
Why Disc Geometry Matters In Wafer Production GalleryWhy Disc Geometry Matters In Wafer Production
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Why Disc Geometry Matters In Wafer Production
This is the first of three articles in Semiconductor Wafer Measurement for Increased Profitability. The second article examines the cost of failing to inspect semiconductor wafers. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec after cutting, it may be possible to reprocess the wafer. Cutting is only the first [...]
How Capacitive Measurement Can Help Reduce Packaging Waste
Product packaging is often made of lightweight polymeric foams or plastic sheets and films. These materials are relatively inexpensive, but manufacturers still want to minimize waste and maximize yields. Across high volumes of low-cost materials, even a small per-unit savings can become significant, especially as the price of petroleum – a key ingredient in many polymers – continues to rise. For companies with environmental sustainability efforts, there are other important considerations as well. The excessive use of packaging materials can contribute to environmental pollution, especially with polymers that are slow to degrade. Yet, materials such as plastic sheets and [...]
Non-Contact Displacement Sensors for Detection and Measurement
Non-contact displacement sensors are designed to detect or measure physical properties such as linear displacement, thickness, proximity, and distance without physically touching the target. By emitting various forms of energy, such as capacitance, fiber optic, or laser triangulation, these sensors capture highly accurate readings without physically touching the object. This contrasts with traditional contact sensors, which rely on direct mechanical contact to gauge displacement or other physical properties. Benefits of Non-Contact vs. Contact Displacement Sensors Compared to contact sensors, non-contact displacement sensors offer faster response times, higher sampling rates, and minimal interference with the object being measured. They are [...]
Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance GalleryAdvantages of Measuring Semiconductor Thin Film Thickness with Capacitance
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Advantages of Measuring Semiconductor Thin Film Thickness with Capacitance
Thin Film Thickness Measurement Using Capacitance in the Semiconductor Industry In the semiconductor industry, the precise measurement of thin film thickness is crucial for ensuring the quality and functionality of wafer coatings. Thin films are deposited onto silicon and other wafer materials one atomic layer at a time, and the thickness of these coatings significantly impacts the wafer’s electrical, optical, and mechanical properties. Thin film thickness measurement is particularly important for semiconductor wafers, which may have either conductive metallic films or non-conductive metal oxide films deposited onto them. Common deposition methods include chemical vapor deposition (CVD) and physical vapor [...]
How Often Should Vibration Analysis Be Performed?
How Often Should Vibration Analysis Be Performed? Once a customer takes delivery of a PBS system and learns how to use it, the next logical question is: “How often should we use it?” At a minimum, your approved maintenance program (whether it’s a program developed by your operation, or the maintenance procedures outlined by the engine/airframe manufacturer) will tell you about the intervals at which to perform a vibration analysis. Usually, there is a procedure to specify how an engine vibration analysis and balance need be only completed when squawked by a pilot or after the completion of maintenance [...]
Contact vs. Non-Contact Measurement and Linear Displacement Sensors GalleryContact vs. Non-Contact Measurement and Linear Displacement Sensors
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Contact vs. Non-Contact Measurement and Linear Displacement Sensors
Contact vs. Non-Contact Measurements Choosing between a contact measurement system and a non-contact measurement system requires careful evaluation of your application’s performance needs, material properties, environmental conditions, and measurement goals. Each system type offers unique advantages- and understanding these distinctions can help you make a more informed decision. Let's explores how contact and non-contact measurement techniques work, their strengths and limitations, and where they’re best applied. What Are Contact Measurement Systems? Contact measurement systems involve tools and sensors that physically touch the object to determine various physical characteristics. These systems are widely used in dimensional metrology, offering high precision, [...]
Capacitance Sensors vs. Eddy Current Sensors Application Note
Capacitance Sensors vs. Eddy Current Sensors Application Note Capacitance sensors and Eddy current sensors are both used for non-contact measurements. Capacitive probes use electric fields to measure the distance from the sensor face to the surface of a target that is typically conductive and grounded. Eddy current probes use an alternating AC current to induce a magnetic field in a conductive target instead. In turn, the induced magnetic field produces a back magnetic field that is proportional to the gap between the probe face and the target. In a recent application note, MTI Instruments examines the differences between capacitance [...]