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Wafer Backgrinding and Semiconductor Thickness Measurements

Wafer Backgrinding and Thickness Measurements in Semiconductor Manufacturing Wafer backgrinding, also known as wafer thinning or wafer lapping, is a critical step in semiconductor packaging. This process, which involves grinding the backside of a semiconductor wafer, reduces its thickness to enable the stacking of integrated circuits (ICs) and support high-density packaging. The thickness of the wafer plays a crucial role in determining the overall size of the package, an important factor as modern electronics such as smartphones, laptops, and other devices continue to get thinner and more compact. In applications like MEMS (Micro-Electro-Mechanical Systems), the backgrinding process also affects [...]

Silicon Carbide vs. Silicon in EV Power Electronics

Compare silicon carbide vs. silicon for electric vehicle (EV) power electronics and learn about SiC wafer measurement. As demand for electric vehicles (EVs) continues to grow, manufacturers are comparing two semiconductor technologies, silicon carbide and silicon, for power electronics applications. Silicon carbide (SiC) provides the high temperature resistance, low power consumption, rigidity, and support for smaller, thinner designs that EV power electronics need. Examples of SiC’s current applications include on-board DC/DC converters, off-board DC fast chargers, on-board battery chargers, EV powertrains, and automotive lighting for LEDs. According to Automotive World, SiC technology could also drive future EV innovations [...]

White Paper: Electrical Safety & Compliance Testing for Appliance & Consumer Product Manufacturers

   Introduction Electrical appliances, computers and peripherals, power tools and other devices found in the home and office environments must be tested to confirm adherence to a plethora of stringent certification standards. The vast array of consumer devices for the home and office — from blenders and ovens to computers and high-definition LED TVs — are becoming increasingly sophisticated. Refrigerators, once basic electrical appliances, now often include adjustable speed motor controls, digital displays and Bluetooth communications. While the complexity and functionality found in this class of devices varies extensively, there is one thing they all have in common when [...]

By |November 12th, 2020|Categories: Brand-Vitrek, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, News-Vitrek, Products-Vitrek, Whitepapers-Vitrek, z1|Comments Off on White Paper: Electrical Safety & Compliance Testing for Appliance & Consumer Product Manufacturers

Press Release: Vitrek Announces New SE Series High Voltage Safety Enclosures

Vitrek Announces the SE Series of High Voltage Safety Enclosures The SE Series offers the utmost in operator safety for high voltage testing with solid aluminum frame construction, a durable acrylic cover and a magnetic interlock safety switch.   […]

EV Batteries Need Thickness Gauging for Lower Costs and Higher Performance

EV batteries need to cost less and last longer. Until the e-mobility industry solves these challenges, electric vehicle (EV) adoption won’t match the hype that’s driven by Tesla, the established automakers, and a host of startups who are attracting investors. According to Axios, the expense of owning an electric vehicle will exceed that of owning a conventional one until EV batteries cost less than $100/KWh to produce. Unfortunately, the EV industry isn’t expected to hit that target for another ten years. Yet, there is some encouraging news. Less expensive and better performing EV batteries are just a few years [...]

High Resolution Semiconductor Wafer Measurements at Lower Costs

MTI's Proforma technology characterizes semiconductor wafers in terms of bow and warp, thickness, total thickness variation (TTV) and center thickness. Until recently, semiconductor wafer measurements at resolutions less than 100 µm were cost-prohibitive.  Moreover, only expensive devices such as interferometers were capable of these measurements. Today, the semiconductor industry can use capacitance gauges instead of laser interferometers to achieve high resolution at fraction of the cost. Much like affordable CCD cameras transformed and expanded the market for video, cost-effective capacitance is disrupting the semiconductor wafer measurement market and creating new opportunities for quality testing and validation. The [...]

By |July 22nd, 2020|Categories: Application Notes-MTI, Brand-MTI, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, Products-MTI-Capacitance, Products-MTI-Semiconductor/Metrology, Z-REPUB, z1|Comments Off on High Resolution Semiconductor Wafer Measurements at Lower Costs

Measure Wafer Bow, Warp and TTV with Capacitance

The flatness of silicon wafers used to manufacture integrated circuits is controlled to tight tolerances to help ensure that the whole wafer is sufficiently flat for lithographic processing. To ensure your wafer manufacturing process is within tolerance, you need to measure the wafers being produced. Various measurement techniques exist to verify process tolerances and eliminate expensive scrap wafers. Non-contact capacitive sensing is a highly precise and cost-effective means to measure wafer flatness, bow, warp, and total thickness variation (TTV). MTI Instruments’ Proforma 300i and 300iSA systems use capacitance sensors to improve yields while reducing costs through better dimensional control of [...]

How to Measure Dielectric Separator Thickness in EV Batteries

The International Energy Agency predicts that as many as 125 million electric vehicles (EVs) will be on the road by 2030. At the heart of these electric cars, trucks, and buses is the lithium-ion (Li-ion) battery, a type of rechargeable battery with high energy density and low self-discharge. The plates in Li-ion batteries consist of lithium compounds that are applied to either a copper plate substrate (cathode) or an aluminum substrate (anode). In turn, these two plates are separated by a dielectric separator. All of the layers in an EV battery are extremely thin. In fact, the cathode and [...]

Capacitance Sensing for Non-Contact Thickness Measurements of Insulating Materials

Capacitance sensing can be used to make non-contact thickness measurements for most insulating materials. Capacitance sensors are known for their ability to precisely measure the thickness and position of conductive targets, but what’s less known is that these sensors can also measure the thickness of non-conductive materials. Examples include glass, sapphire, and plastics, as well as semi-insulating semiconductor materials such as GaAs and silicon nitride. Analog vs. Digital Technologies MTI Instruments, a global supplier of precision measurement technologies, takes the guesswork out of what used to be a complex measurement for non-conductive materials. MTI's Digital Accumeasure system features a [...]

Trends in High Resolution Sensors for Semiconductor Metrology and Inspection

High resolution sensors are supporting improvements in semiconductor metrology and inspection at vital points in the production process. Because the fabrication of semiconductor wafers may require hundreds of steps and weeks of manufacturing time, early-stage defects that go undetected can have costly downstream consequences. Plus, because semiconductor processing always requires a high degree of precision, advances in fabrication methods seem to require ever-finer measurements in a never-ending quest. Today’s metrology instruments are incorporating high resolution sensors for automated wafer inspection. Resolution, the smallest measurement that a sensor can reliably indicate, may be given in dimensional units such as nanometers [...]

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